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XCAU15P-2SBVB484I - AMD

Description: Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 204 5347738 170100 484-BFBGA, FCBGA

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PCB Footprints
XCAU15P-2SBVB484I - AMD PCB footprint - BGA - BGA - SBVB484
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XCAU15P-2SBVB484I - AMD  - 3D model - BGA - SBVB484
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XCAU15P-2SBVB484I Details

  • Manufacturer Part Number:

    XCAU15P-2SBVB484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-484

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    9720

  • Number of Inputs:

    204

  • Number of Logic Cells:

    170100

  • Number of Outputs:

    204

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    9720 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.79 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

XCAU15P-2SBVB484I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XCAU15P-2SBVB484I is -40°C to 100°C, as specified in the datasheet. However, it's recommended to operate within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity on the high-speed interfaces, it's essential to follow the recommended PCB layout guidelines, use controlled impedance traces, and add termination resistors as specified in the datasheet. Additionally, consider using signal integrity analysis tools to simulate and optimize the design.
  • The recommended power-up sequence for the XCAU15P-2SBVB484I is to power up the VDDIO and VDDCAU supplies simultaneously, followed by the VDDPLL supply. This sequence helps to ensure proper device initialization and prevents potential latch-up conditions.
  • During device reset, it's recommended to tri-state the JTAG interface to prevent any unwanted data from being shifted into the device. This can be achieved by asserting the TRST signal or by using a JTAG controller that supports reset detection.
  • When using the XCAU15P-2SBVB484I in a radiation-hardened environment, it's essential to follow AMD's guidelines for radiation tolerance and to implement appropriate radiation mitigation techniques, such as error correction codes and radiation-hardened design practices.

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XCAU15P-2SBVB484I Overview

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