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XCAU20P-1SFVB784E - AMD

Description: FPGA - Field Programmable Gate Array XCAU20P-1SFVB784E

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XCAU20P-1SFVB784E - AMD PCB footprint - BGA - BGA - SFVC784
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XCAU20P-1SFVB784E - AMD  - 3D model - BGA - SFVC784
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XCAU20P-1SFVB784E Details

  • Manufacturer Part Number:

    XCAU20P-1SFVB784E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-784

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B784

  • Length:

    23 mm

  • Number of CLBs:

    13625

  • Number of Inputs:

    228

  • Number of Logic Cells:

    238437

  • Number of Outputs:

    228

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Organization:

    13625 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA784,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.32 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

XCAU20P-1SFVB784E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XCAU20P-1SFVB784E is -40°C to 100°C, as specified in the datasheet. However, it's recommended to operate within the commercial temperature range of 0°C to 70°C for optimal performance and reliability.
  • To optimize power consumption, ensure that the device is operated within the recommended voltage range, and consider using power-saving features such as dynamic voltage and frequency scaling (DVFS) and clock gating. Additionally, optimize your design to minimize idle time and use low-power modes when possible.
  • For optimal performance and signal integrity, follow the recommended PCB layout guidelines provided in the datasheet, including signal routing, decoupling, and power plane design. Ensure that the PCB material and thickness meet the recommended specifications, and consider using a 4-layer or 6-layer PCB for better signal isolation and noise reduction.
  • To troubleshoot common issues, start by verifying the power supply and clock signals, ensuring that they meet the recommended specifications. Check for proper device configuration and programming, and review the system design for potential bottlenecks or signal integrity issues. Use debugging tools and software provided by AMD or third-party vendors to identify and isolate the problem.
  • To prevent damage and ensure reliability, store the XCAU20P-1SFVB784E in a dry, cool environment, away from direct sunlight and moisture. Handle the device by the edges, avoiding touching the pins or electrical contacts. Use anti-static packaging and follow proper electrostatic discharge (ESD) precautions when handling the device.

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XCAU20P-1SFVB784E Overview

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