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XCAU25P-2FFVB676I - AMD

Description: Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 280 11010048 308437 676-BBGA, FCBGA

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XCAU25P-2FFVB676I - AMD PCB footprint - BGA - BGA - FFVB676
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XCAU25P-2FFVB676I - AMD  - 3D model - BGA - FFVB676
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XCAU25P-2FFVB676I Details

  • Manufacturer Part Number:

    XCAU25P-2FFVB676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    17625

  • Number of Inputs:

    280

  • Number of Logic Cells:

    308437

  • Number of Outputs:

    280

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    17625 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.52 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XCAU25P-2FFVB676I Frequently Asked Questions (FAQs)

  • AMD provides a reference design guide for the XCAU25P-2FFVB676I, which includes recommendations for PCB layout, thermal design, and heat sink attachment. It's essential to follow these guidelines to ensure optimal performance and prevent overheating.
  • The XCAU25P-2FFVB676I has a complex power management system. AMD provides a power management guide that explains how to implement power gating, clock gating, and voltage regulation. Additionally, the device has a built-in clock management unit that requires configuration. Engineers should consult the power management guide and the device's datasheet for detailed information.
  • The XCAU25P-2FFVB676I has a unique boot process that involves loading firmware from an external memory device. AMD provides a boot loader specification document that outlines the requirements for the boot process, including the format of the firmware image and the loading sequence. Engineers should consult this document to ensure successful firmware loading.
  • Optimizing the XCAU25P-2FFVB676I's performance requires a deep understanding of the device's architecture and the application's requirements. AMD provides a performance optimization guide that offers tips and techniques for optimizing the device's performance, including cache optimization, memory access optimization, and pipeline optimization. Engineers should consult this guide and experiment with different optimization techniques to achieve the best performance for their specific application.
  • The XCAU25P-2FFVB676I has a wide range of peripherals and interfaces, each with its own limitations and constraints. Engineers should consult the device's datasheet and user manual to understand the limitations of each peripheral and interface, including bandwidth, latency, and compatibility issues.

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XCAU25P-2FFVB676I Overview

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