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XCAU25P-2SFVB784I - AMD

Description: FPGA - Field Programmable Gate Array XCAU25P-2SFVB784I

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PCB Footprints
XCAU25P-2SFVB784I - AMD PCB footprint - BGA - BGA - SFVB784
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3D Models
XCAU25P-2SFVB784I - AMD  - 3D model - BGA - SFVB784
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XCAU25P-2SFVB784I Details

  • Manufacturer Part Number:

    XCAU25P-2SFVB784I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA, BGA784,28X28,32

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B784

  • Length:

    23 mm

  • Number of CLBs:

    17625

  • Number of Inputs:

    304

  • Number of Logic Cells:

    308437

  • Number of Outputs:

    304

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    17625 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA784,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.32 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

XCAU25P-2SFVB784I Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for XCAU25P-2SFVB784I is 0°C to 100°C, with a junction temperature (TJ) of up to 125°C.
  • To optimize power consumption, use the power gating feature, reduce clock frequency, and minimize voltage supply. Additionally, use the AMD-provided power management tools and follow the guidelines in the datasheet.
  • The maximum current draw for XCAU25P-2SFVB784I is typically around 3.5A for the core voltage (VCC) and 1.5A for the I/O voltage (VCCAUX), but this may vary depending on the specific use case and operating conditions.
  • To ensure signal integrity, follow the guidelines in the datasheet for trace length, impedance, and termination. Additionally, use simulation tools and perform signal integrity analysis to optimize the design.
  • Follow the guidelines in the datasheet for PCB layout, including recommendations for decoupling capacitors, power plane design, and signal routing. Additionally, use AMD-provided layout guidelines and reference designs.

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XCAU25P-2SFVB784I Overview

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