Part Image

XCC1312R1F3RGZR - Texas Instruments

Description: SimpleLink™ Sub-1 GHz CC1312R Wireless MCU

Download XCC1312R1F3RGZR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
XCC1312R1F3RGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048A
click to zoom
3D Models
XCC1312R1F3RGZR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048A
click to zoom

XCC1312R1F3RGZR Details

  • Manufacturer Part Number:

    XCC1312R1F3RGZR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFN-48

  • HTS Code:

    8542.31.00.30

  • Date Of Intro:

    2018-01-26

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    DIMENSION CONSIDER BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCC1312R1F3RGZR Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Texas Instruments' recommended PCB layout guidelines, including using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat. A thermal pad on the bottom of the package can also be used to improve heat dissipation.
  • To ensure reliable wireless connectivity, it's essential to follow proper antenna design and placement guidelines, use a suitable wireless protocol, and implement frequency hopping and adaptive frequency selection to minimize interference. Additionally, using a shielded enclosure and keeping the device away from other wireless devices can help reduce interference.
  • The XCC1312R1F3RGZR has a low power consumption of approximately 5.5mA in receive mode and 20mA in transmit mode. Battery life expectations vary depending on the application, but with a 1000mAh battery, you can expect around 1-2 years of battery life with moderate usage.
  • To implement secure wireless communication, use encryption protocols such as AES-128 or AES-256, and implement secure key exchange and authentication mechanisms. Additionally, use secure boot mechanisms and ensure that firmware updates are secure and authenticated.
  • The XCC1312R1F3RGZR has an operating temperature range of -40°C to 85°C and a storage temperature range of -40°C to 125°C. It's essential to ensure that the device operates within these temperature ranges to ensure reliable performance and longevity.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

XCC1312R1F3RGZR Overview

Use the download button to access the XCC1312R1F3RGZR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XCC13, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to XCC1312R1F3RGZR

Showing 0 results