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XCC2652R1FRGZR - Texas Instruments

Description: SimpleLink™ Multi-Standard CC2652R Wireless MCU

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PCB Footprints
XCC2652R1FRGZR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048A
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3D Models
XCC2652R1FRGZR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048A
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XCC2652R1FRGZR Details

  • Manufacturer Part Number:

    XCC2652R1FRGZR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFN-48

  • HTS Code:

    8542.31.00.25

  • Date Of Intro:

    2018-01-26

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO HAS 256KB ROM

  • Bit Size:

    32

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    31

  • Number of Terminals:

    48

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.28SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    81920

  • ROM (words):

    360448

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    48 MHz

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

XCC2652R1FRGZR Frequently Asked Questions (FAQs)

  • TI recommends a 4-layer PCB with a solid ground plane, and a separate power plane for the radio frequency (RF) section. A good layout should also minimize signal traces near the antenna to reduce radiation.
  • Use a 50-ohm antenna with a quarter-wavelength monopole or a dipole antenna. Ensure the antenna is placed at least 10 mm away from the PCB edge and other components. TI provides an antenna design guide in the XCC2652R1FRGZR documentation.
  • The maximum transmit power is +20 dBm. You can adjust the transmit power using the TI's SmartRF Studio software or by modifying the device's register settings. However, be aware of regional regulations and ensure compliance with local transmission power limits.
  • Use the XCC2652R1FRGZR's built-in coexistence features, such as adaptive frequency hopping and dynamic channel switching. You can also implement custom coexistence algorithms using the device's APIs and interrupts.
  • Use a 32.768 kHz crystal oscillator with a load capacitance of 12-15 pF. Ensure the oscillator is placed close to the XCC2652R1FRGZR and use a dedicated power supply to minimize noise and interference.

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XCC2652R1FRGZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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