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XCKU035-1FBVA900C - AMD

Description: FPGA - Field Programmable Gate Array XCKU035-1FBVA900C

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PCB Footprints
XCKU035-1FBVA900C - AMD PCB footprint - BGA - BGA - FBVA900 Bare-die Flip-Chip, Fine-Pitch BGA (XCKU035 and XCKU040)
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3D Models
XCKU035-1FBVA900C - AMD  - 3D model - BGA - FBVA900 Bare-die Flip-Chip, Fine-Pitch BGA (XCKU035 and XCKU040)
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XCKU035-1FBVA900C Details

  • Manufacturer Part Number:

    XCKU035-1FBVA900C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    1700

  • Number of Inputs:

    520

  • Number of Logic Cells:

    444343

  • Number of Outputs:

    520

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1700 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.8 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    31 mm

XCKU035-1FBVA900C Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU035-1FBVA900C is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • The maximum operating temperature of the XCKU035-1FBVA900C is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx guidelines for PCB design, use controlled impedance traces, and add termination resistors as needed. Additionally, use the FPGA's built-in signal integrity features, such as deskew and phase alignment, to minimize signal degradation.
  • The maximum clock frequency supported by the XCKU035-1FBVA900C is 500 MHz, but it can vary depending on the specific device grade, operating conditions, and design implementation.

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XCKU035-1FBVA900C Overview

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Part Image XCKU035-1FBVA900E AMD

Field Programmable Gate Array, 25391 CLBS, 444343-Cell, PBGA900

Part Image XCKU035-1FBVA900E AMD Xilinx

Field Programmable Gate Array, 25391 CLBS, 444343-Cell, PBGA900