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XCKU035-2SFVA784I - AMD

Description: FPGA - Field Programmable Gate Array XCKU035-2SFVA784I

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XCKU035-2SFVA784I - AMD PCB footprint - BGA - BGA - XCKU035-2SFVA784I
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XCKU035-2SFVA784I Details

  • Manufacturer Part Number:

    XCKU035-2SFVA784I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-784

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B784

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Number of CLBs:

    25391

  • Number of Inputs:

    520

  • Number of Logic Cells:

    444343

  • Number of Outputs:

    520

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    25391 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA784,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.52 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

XCKU035-2SFVA784I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU035-2SFVA784I is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power optimization IP cores and following the Xilinx Power Management Guide.
  • The maximum operating temperature of the XCKU035-2SFVA784I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the specified temperature range to ensure optimal performance and reliability.
  • The XCKU035-2SFVA784I is not a radiation-hardened device. For radiation-hardened applications, consider using AMD's QPro or RT Pro devices, which are designed to meet the requirements of aerospace, defense, and high-reliability applications.
  • To ensure signal integrity, follow the guidelines in the Xilinx Signal Integrity Guide, use the IBIS model for simulation, and consider using the AMD-provided signal integrity IP cores. Additionally, ensure proper PCB design, routing, and termination to minimize signal degradation.

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XCKU035-2SFVA784I Overview

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Image Part Number Model
Part Image XCKU035-2SFVA784E AMD Xilinx

Field Programmable Gate Array, 25391 CLBS, 444343-Cell, PBGA784

Part Image XCKU035-2SFVA784I AMD Xilinx

Field Programmable Gate Array, 25391 CLBS, 444343-Cell, PBGA784