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XCKU040-1FFVA1156C - AMD

Description: XILINX - XCKU040-1FFVA1156C - FPGA, KINTEX ULTRASCALE, 520 I/O, FCBGA

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PCB Footprints
XCKU040-1FFVA1156C - AMD PCB footprint - BGA - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)
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XCKU040-1FFVA1156C - AMD  - 3D model - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)
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XCKU040-1FFVA1156C Details

  • Manufacturer Part Number:

    XCKU040-1FFVA1156C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    1920

  • Number of Inputs:

    520

  • Number of Logic Cells:

    530250

  • Number of Outputs:

    520

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1920 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

XCKU040-1FFVA1156C Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU040-1FFVA1156C is approximately 2.5W, but this can vary depending on the specific design and operating conditions.
  • To implement a reliable clocking scheme, use the FPGA's built-in clocking resources, such as the Mixed-Mode Clock Manager (MMCM) or the Phase-Locked Loop (PLL) blocks. These resources can help generate stable clock signals and minimize clock skew.
  • To optimize your design for area and speed, use the Vivado Design Suite's built-in optimization tools, such as the 'Report Clock Utilization' and 'Report Area Utilization' features. Additionally, consider using pipelining, retiming, and other design techniques to improve performance and reduce area usage.
  • To ensure reliable data transfer between the FPGA and external memory, use the FPGA's built-in memory controllers, such as the Memory Interface Generator (MIG) or the DDR4 Memory Controller. These controllers can help manage data transfer and minimize errors.
  • To implement a reliable reset strategy, use a synchronous reset approach, where the reset signal is synchronized with the clock signal. Additionally, consider using a reset controller IP core to manage the reset sequence and ensure that all components are properly reset.

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XCKU040-1FFVA1156C Overview

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Part Image XCKU040-1FFVA1156I AMD

Field Programmable Gate Array, 1920 CLBs, 530250-Cell, PBGA1156

Part Image XCKU040-1FFVA1156I AMD Xilinx

Field Programmable Gate Array, 1920 CLBs, 530250-Cell, PBGA1156

Part Image XCKU040-1FFVA1156C AMD Xilinx

Field Programmable Gate Array, 1920 CLBs, 530250-Cell, PBGA1156