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XCKU060-1FFVA1156I - AMD

Description: XILINX - XCKU060-1FFVA1156I - FPGA, KIntex UltraScale, MMCM, PLL, 520 I/O's, 630 MHz, 725550 Cells, 922 mV to 979 mV, FCBGA-1156

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XCKU060-1FFVA1156I - AMD PCB footprint - BGA - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA
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XCKU060-1FFVA1156I - AMD  - 3D model - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA
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XCKU060-1FFVA1156I Details

  • Manufacturer Part Number:

    XCKU060-1FFVA1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    2760

  • Number of Inputs:

    624

  • Number of Logic Cells:

    725550

  • Number of Outputs:

    624

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2760 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.51 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XCKU060-1FFVA1156I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU060-1FFVA1156I is approximately 12W, but this can vary depending on the specific design and operating conditions.
  • To implement a reliable clocking scheme, use the FPGA's built-in clocking resources, such as the Mixed-Mode Clock Manager (MMCM) or the Phase-Locked Loop (PLL). These resources can help generate stable clock signals and minimize clock skew.
  • To optimize your design for area and speed, use the Vivado Design Suite's built-in optimization tools, such as the 'Optimize for Area' and 'Optimize for Speed' options. Additionally, consider using pipelining, parallel processing, and other design techniques to improve performance.
  • To ensure reliable data transfer between different clock domains, use synchronization techniques such as FIFOs, gray counters, or asynchronous FIFOs. These techniques can help prevent data corruption and ensure reliable data transfer.
  • The XCKU060-1FFVA1156I has a limited number of I/O resources, including 560 user I/Os and 24 transceivers. Be mindful of these limitations when designing your system to ensure that you do not exceed the available resources.

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XCKU060-1FFVA1156I Overview

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Part Image XCKU060-1FFVA1156C AMD

Field Programmable Gate Array, 2760 CLBs, 725550-Cell, PBGA1156

Part Image XCKU060-1FFVA1156C AMD Xilinx

Field Programmable Gate Array, 2760 CLBs, 725550-Cell, PBGA1156