XCKU115-L1FLVB1760I - AMD

XCKU115-L1FLVB1760I Details

• Manufacturer Part Number:

  XCKU115-L1FLVB1760I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-1760

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Manufacturer:

  AMD

• YTEOL:

  10

• Additional Feature:

  ALSO OPERATES AT 0.95V NOMINAL SUPPLY

• JESD-30 Code:

  S-PBGA-B1760

• JESD-609 Code:

  e1

• Length:

  42.5 mm

• Moisture Sensitivity Level:

  4

• Number of CLBs:

  5520

• Number of Inputs:

  832

• Number of Logic Cells:

  1451100

• Number of Outputs:

  832

• Number of Terminals:

  1760

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  5520 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA1760,42X42,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  245

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  4.11 mm

• Supply Voltage-Max:

  0.927 V

• Supply Voltage-Min:

  0.873 V

• Supply Voltage-Nom:

  0.9 V

• Surface Mount:

  YES

• Technology:

  16 nm

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  42.5 mm