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XCKU11P-1FFVD900I - AMD

Description: FPGA - Field Programmable Gate Array XCKU11P-1FFVD900I

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XCKU11P-1FFVD900I - AMD PCB footprint - BGA - BGA - FFVD900
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XCKU11P-1FFVD900I - AMD  - 3D model - BGA - FFVD900
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XCKU11P-1FFVD900I Details

  • Manufacturer Part Number:

    XCKU11P-1FFVD900I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    37320

  • Number of Inputs:

    512

  • Number of Logic Cells:

    653100

  • Number of Outputs:

    512

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    37320 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    31 mm

XCKU11P-1FFVD900I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU11P-1FFVD900I is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The XCKU11P-1FFVD900I has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications, including those in harsh environments.
  • To ensure signal integrity, follow the Xilinx PCB Design Guide, use controlled impedance routing, and add termination resistors as needed. Additionally, use the Xilinx Signal Integrity Wizard to analyze and optimize your design.
  • The XCKU11P-1FFVD900I supports clock frequencies up to 1.2 GHz, depending on the specific device grade and operating conditions.

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XCKU11P-1FFVD900I Overview

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Part Image XCKU11P-1FFVD900E AMD Xilinx

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA900

Part Image XCKU11P-1FFVD900I AMD Xilinx

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA900