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XCKU11P-2FFVE1517E - AMD

Description: XCKU11P-2FFVE1517E

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XCKU11P-2FFVE1517E - AMD - PCB symbol
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PCB Footprints
XCKU11P-2FFVE1517E - AMD PCB footprint - BGA - BGA - FFVF1517
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XCKU11P-2FFVE1517E - AMD - 3D model - BGA - FFVF1517
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XCKU11P-2FFVE1517E Details

  • Manufacturer Part Number:

    XCKU11P-2FFVE1517E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1517

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    37320

  • Number of Inputs:

    512

  • Number of Logic Cells:

    653100

  • Number of Outputs:

    512

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Organization:

    37320 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.51 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

XCKU11P-2FFVE1517E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU11P-2FFVE1517E is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, optimize your design for area and reduce unnecessary logic.
  • The maximum clock frequency supported by the XCKU11P-2FFVE1517E is 500 MHz, but it can vary depending on the specific clock domain and the quality of the clock signal.
  • To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize your design for signal integrity. Additionally, follow best practices for PCB design, such as using differential pairs, adding termination resistors, and minimizing signal routing distances.
  • The recommended operating temperature range for the XCKU11P-2FFVE1517E is -40°C to 100°C, but it can vary depending on the specific application and environmental conditions.

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XCKU11P-2FFVE1517E Overview

Use the download button to access the XCKU11P-2FFVE1517E schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XCKU1, or try a keyword search, such as Field Programmable Gate Arrays

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Part Image XCKU11P-2FFVE1517I AMD

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA1517