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XCKU15P-1FFVA1760E - AMD

Description: UltraScale Architecture

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XCKU15P-1FFVA1760E - AMD PCB footprint - BGA - BGA - FFVA1760
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XCKU15P-1FFVA1760E - AMD  - 3D model - BGA - FFVA1760
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XCKU15P-1FFVA1760E Details

  • Manufacturer Part Number:

    XCKU15P-1FFVA1760E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1760

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1760

  • JESD-609 Code:

    e1

  • Length:

    42.5 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    65340

  • Number of Inputs:

    668

  • Number of Logic Cells:

    1143450

  • Number of Outputs:

    668

  • Number of Terminals:

    1760

  • Operating Temperature-Max:

    100 °C

  • Organization:

    65340 CLBs

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1760,42X42,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.71 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    42.5 mm

XCKU15P-1FFVA1760E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU15P-1FFVA1760E is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • The XCKU15P-1FFVA1760E has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • To ensure signal integrity and reduce noise, use proper PCB design techniques, such as impedance matching, signal shielding, and decoupling capacitors. Additionally, use the FPGA's built-in features, such as transmitter equalization and receiver adaptation, to improve signal quality.
  • The recommended PCB layout and stackup for the XCKU15P-1FFVA1760E can be found in the Xilinx PCB Design Guide (UG583) and the FPGA's datasheet. In general, a 4-6 layer PCB with a stackup of signal-ground-signal-power-ground is recommended.

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XCKU15P-1FFVA1760E Overview

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