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XCKU15P-2FFVE1760E - AMD

Description: FPGA, KINTEX ULTRASCALE+, FCBGA-1760

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PCB Footprints
XCKU15P-2FFVE1760E - AMD PCB footprint - BGA - BGA - FFVF1760
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XCKU15P-2FFVE1760E - AMD  - 3D model - BGA - FFVF1760
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XCKU15P-2FFVE1760E Details

  • Manufacturer Part Number:

    XCKU15P-2FFVE1760E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1760

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1760

  • JESD-609 Code:

    e1

  • Length:

    42.5 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    65340

  • Number of Inputs:

    668

  • Number of Logic Cells:

    1143450

  • Number of Outputs:

    668

  • Number of Terminals:

    1760

  • Operating Temperature-Max:

    100 °C

  • Organization:

    65340 CLBs

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1760,42X42,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.71 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    42.5 mm

XCKU15P-2FFVE1760E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU15P-2FFVE1760E is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power optimization IP cores and following the Xilinx Power Management Guide.
  • The maximum operating temperature of the XCKU15P-2FFVE1760E is 100°C (industrial grade) or 125°C (extended industrial grade), depending on the specific device grade.
  • To ensure signal integrity, follow the Xilinx PCB Design Guide, use controlled impedance routing, and add termination resistors as needed. Additionally, use the Xilinx Signal Integrity Wizard to analyze and optimize your design.
  • The maximum clock frequency supported by the XCKU15P-2FFVE1760E is 500 MHz, but this can vary depending on the specific device speed grade and the design's clock domain architecture.

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XCKU15P-2FFVE1760E Overview

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Part Image XCKU15P-2FFVE1760I AMD

Field Programmable Gate Array, 65340 CLBs, 1143450-Cell, PBGA1760

Part Image XCKU15P-2FFVE1760E AMD Xilinx

Field Programmable Gate Array, 65340 CLBs, 1143450-Cell, PBGA1760