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XCKU15P-L2FFVA1156E - AMD

Description: Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 516 82329600 1143450 1156-BBGA, FCBGA

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XCKU15P-L2FFVA1156E - AMD PCB footprint - BGA - BGA - 1156-FCBGA (35x35)
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3D Models
XCKU15P-L2FFVA1156E - AMD  - 3D model - BGA - 1156-FCBGA (35x35)
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XCKU15P-L2FFVA1156E Details

  • Manufacturer Part Number:

    XCKU15P-L2FFVA1156E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES AT 0.85V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    65340

  • Number of Inputs:

    668

  • Number of Logic Cells:

    1143450

  • Number of Outputs:

    668

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    110 °C

  • Organization:

    65340 CLBs

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.71 mm

  • Supply Voltage-Max:

    0.742 V

  • Supply Voltage-Min:

    0.698 V

  • Supply Voltage-Nom:

    0.72 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

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XCKU15P-L2FFVA1156E Overview

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Part Image XCKU15P-L2FFVA1156E AMD Xilinx

Field Programmable Gate Array, 65340 CLBs, 1143450-Cell, PBGA1156