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XCVU13P-1FHGA2104I - AMD

Description: IC FPGA 832 I/O 2104FCBGA

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PCB Footprints
XCVU13P-1FHGA2104I - AMD PCB footprint - BGA - BGA - FHGA2104_2021
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3D Models
XCVU13P-1FHGA2104I - AMD  - 3D model - BGA - FHGA2104_2021
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XCVU13P-1FHGA2104I Details

  • Manufacturer Part Number:

    XCVU13P-1FHGA2104I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2104

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2104

  • Length:

    52.5 mm

  • Number of CLBs:

    216000

  • Number of Inputs:

    832

  • Number of Logic Cells:

    3780000

  • Number of Outputs:

    832

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    216000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.24 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    52.5 mm

XCVU13P-1FHGA2104I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU13P-1FHGA2104I is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Vivado Power Analysis tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD Power Estimator (APE) tool to estimate power consumption early in the design cycle.
  • The maximum operating temperature of the XCVU13P-1FHGA2104I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, use differential signaling where possible, and follow AMD's guidelines for signal integrity and PCB design.
  • AMD provides guidelines for PCB layout and stackup in the XCVU13P-1FHGA2104I datasheet and user manual. In general, a 4-6 layer PCB with a thickness of 0.8-1.2 mm is recommended, with a solid ground plane and careful routing of high-speed signals.

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XCVU13P-1FHGA2104I Overview

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Part Image XCVU13P-1FHGA2104I AMD Xilinx

Field Programmable Gate Array, 216000 CLBS, 3780000-Cell, PBGA2104