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XCVU19P-1FSVA3824E - AMD

Description: FPGA - Field Programmable Gate Array XCVU19P-1FSVA3824E

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PCB Footprints
XCVU19P-1FSVA3824E - AMD PCB footprint - BGA - BGA - FSVA3824
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3D Models
XCVU19P-1FSVA3824E - AMD  - 3D model - BGA - FSVA3824
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XCVU19P-1FSVA3824E Details

  • Manufacturer Part Number:

    XCVU19P-1FSVA3824E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-3824

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B3824

  • Length:

    65 mm

  • Number of CLBs:

    510720

  • Number of Inputs:

    2072

  • Number of Logic Cells:

    8937600

  • Number of Outputs:

    2072

  • Number of Terminals:

    3824

  • Operating Temperature-Max:

    100 °C

  • Organization:

    510720 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA3824,63X63,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.64 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    65 mm

XCVU19P-1FSVA3824E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU19P-1FSVA3824E is approximately 25W, but it can vary depending on the specific application, clock frequency, and usage of resources.
  • To optimize power consumption, use the Vivado Power Analysis tool, enable power gating, reduce clock frequencies, and optimize resource utilization. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The XCVU19P-1FSVA3824E has an operating temperature range of -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade). However, it's essential to ensure proper cooling and thermal management to maintain reliability and performance.
  • Yes, the XCVU19P-1FSVA3824E is suitable for high-reliability applications. It's built with a 16nm process and has undergone rigorous testing and qualification. However, it's essential to follow AMD's guidelines for high-reliability design and manufacturing, and to consult with AMD's support team for specific requirements.
  • To ensure signal integrity and reduce EMI, follow AMD's guidelines for PCB design, use controlled impedance routing, and implement proper shielding and grounding techniques. Additionally, use the Vivado Design Suite's built-in signal integrity analysis tools to identify and mitigate potential issues.

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XCVU19P-1FSVA3824E Overview

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