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XCVU33P-2FSVH2104E - AMD

Description: Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 208 24746394 961800 2104-BBGA, FCBGA

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PCB Footprints
XCVU33P-2FSVH2104E - AMD PCB footprint - BGA - BGA - FSVH2104 (XCVU33P) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
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3D Models
XCVU33P-2FSVH2104E - AMD  - 3D model - BGA - FSVH2104 (XCVU33P) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
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XCVU33P-2FSVH2104E Details

  • Manufacturer Part Number:

    XCVU33P-2FSVH2104E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FCBGA-2104

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B2104

  • Length:

    47.5 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    54960

  • Number of Inputs:

    208

  • Number of Logic Cells:

    961800

  • Number of Outputs:

    208

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Organization:

    54960 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.51 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    47.5 mm

XCVU33P-2FSVH2104E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU33P-2FSVH2104E is approximately 12W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Vivado Power Analysis tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD Power Estimator (APE) tool to estimate power consumption early in the design cycle.
  • The maximum operating temperature of the XCVU33P-2FSVH2104E is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the specified temperature range to ensure optimal performance and reliability.
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, use differential signaling where possible, and follow AMD's guidelines for signal integrity and PCB design.
  • The maximum clock frequency supported by the XCVU33P-2FSVH2104E is 1.5 GHz, but it can vary depending on the specific design, clock domain, and operating conditions.

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XCVU33P-2FSVH2104E Overview

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