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XCVU3P-L2FFVC1517E - AMD

Description: Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 520 130355200 862050 1517-BBGA, FCBGA

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PCB Footprints
XCVU3P-L2FFVC1517E - AMD PCB footprint - BGA - BGA - FFVC1517
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XCVU3P-L2FFVC1517E - AMD  - 3D model - BGA - FFVC1517
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XCVU3P-L2FFVC1517E Details

  • Manufacturer Part Number:

    XCVU3P-L2FFVC1517E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1517

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES AT 0.85V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    49260

  • Number of Inputs:

    520

  • Number of Logic Cells:

    862050

  • Number of Outputs:

    520

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    110 °C

  • Organization:

    49260 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.51 mm

  • Supply Voltage-Max:

    0.742 V

  • Supply Voltage-Min:

    0.698 V

  • Supply Voltage-Nom:

    0.72 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

XCVU3P-L2FFVC1517E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU3P-L2FFVC1517E is approximately 12W, but this can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Vivado Power Analysis tool to identify power-hungry components, reduce clock frequencies, use clock gating, and implement power-saving techniques like dynamic voltage and frequency scaling.
  • The XCVU3P-L2FFVC1517E has an operating temperature range of -40°C to 100°C, but it's recommended to operate within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.
  • Yes, the XCVU3P-L2FFVC1517E is suitable for high-reliability applications, as it's built with a high-reliability flow and has undergone rigorous testing and qualification. However, additional testing and validation may be required for specific applications.
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, implement signal termination, and use differential signaling where possible. Additionally, follow AMD's guidelines for PCB design and layout.

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XCVU3P-L2FFVC1517E Overview

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