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XCVU440-1FLGA2892C - AMD

Description: IC FPGA 1456 I/O 2892FCBGA

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XCVU440-1FLGA2892C - AMD PCB footprint - BGA - BGA - FLGA2892-
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XCVU440-1FLGA2892C - AMD  - 3D model - BGA - FLGA2892-
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XCVU440-1FLGA2892C Details

  • Manufacturer Part Number:

    XCVU440-1FLGA2892C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2892

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2892

  • JESD-609 Code:

    e1

  • Length:

    55 mm

  • Number of CLBs:

    2880

  • Number of Inputs:

    1456

  • Number of Logic Cells:

    5540850

  • Number of Outputs:

    1456

  • Number of Terminals:

    2892

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2880 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2892,54X54,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.83 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    55 mm

XCVU440-1FLGA2892C Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in the XCVU440 FPGA PCB Design Guide (UG575) and the 7 Series FPGAs PCB Design and Pin Planning Guide (UG583). Additionally, AMD recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes.
  • AMD provides power estimation and thermal management guidelines in the XCVU440 FPGA Power Management Guide (UG576). Engineers can use the Xilinx Power Estimator (XPE) tool to estimate power consumption and optimize their design. Thermal management techniques include using heat sinks, thermal interfaces, and airflow management.
  • AMD recommends using a single, high-quality clock source and distributing it to the FPGA using a clock tree. The XCVU440 FPGA Clocking Guide (UG577) provides detailed guidelines for clocking and reset strategies, including clock domain crossing, clock gating, and reset synchronization.
  • AMD provides signal integrity guidelines in the XCVU440 FPGA Signal Integrity Guide (UG578). Engineers can use techniques such as differential signaling, impedance matching, and shielding to reduce EMI. Additionally, AMD recommends using the IBIS-AMI model and the Xilinx Signal Integrity Wizard to analyze and optimize signal integrity.
  • The XCVU440 FPGA has high-speed transceivers that support up to 32.75 Gbps. However, engineers should consider limitations such as channel bonding, clocking, and signal integrity when designing with these transceivers. AMD provides guidelines and recommendations in the XCVU440 FPGA Transceiver User Guide (UG579).

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XCVU440-1FLGA2892C Overview

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