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XCZU9EG-1FFVC900E - AMD

Description: Zynq UltraScale+ MPSoC, IC FPGA 204 I/O 900FCBGA

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XCZU9EG-1FFVC900E - AMD PCB footprint - BGA - BGA - FFVC900 Flip-Chip, Fine-Pitch BGA
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XCZU9EG-1FFVC900E - AMD  - 3D model - BGA - FFVC900 Flip-Chip, Fine-Pitch BGA
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XCZU9EG-1FFVC900E Details

  • Manufacturer Part Number:

    XCZU9EG-1FFVC900E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B900

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    34260

  • Number of Inputs:

    204

  • Number of Logic Cells:

    599550

  • Number of Outputs:

    204

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Organization:

    34260 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

XCZU9EG-1FFVC900E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU9EG-1FFVC900E is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The XCZU9EG-1FFVC900E has an operating temperature range of -40°C to 100°C, with a junction temperature (TJ) of up to 125°C.
  • To ensure signal integrity, follow the Xilinx Signal Integrity Guidelines, use the Xilinx IBERT (Integrated Bit Error Ratio Tester) tool, and consider using the AMD-provided signal integrity IP cores. Additionally, pay attention to PCB design, routing, and termination.
  • The XCZU9EG-1FFVC900E's PCIe interface supports up to x16 Gen3, with a maximum bandwidth of 9850 MB/s.

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XCZU9EG-1FFVC900E Overview

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