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XCZU9EG-2FFVB1156E - AMD

Description: FPGA - Field Programmable Gate Array

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XCZU9EG-2FFVB1156E - AMD PCB footprint - BGA - BGA - FFVB1156 Flip-Chip, Fine-Pitch BGA
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XCZU9EG-2FFVB1156E - AMD  - 3D model - BGA - FFVB1156 Flip-Chip, Fine-Pitch BGA
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XCZU9EG-2FFVB1156E Details

  • Manufacturer Part Number:

    XCZU9EG-2FFVB1156E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B1156

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    34260

  • Number of Inputs:

    328

  • Number of Logic Cells:

    599550

  • Number of Outputs:

    328

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Organization:

    34260 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

XCZU9EG-2FFVB1156E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU9EG-2FFVB1156E is approximately 25W, but it can vary depending on the specific application, clock frequency, and usage of resources.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and optimize the design for low power using techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • The maximum operating temperature of the XCZU9EG-2FFVB1156E is 100°C (industrial grade) or 125°C (extended temperature range).
  • To ensure signal integrity, use the Xilinx Signal Integrity (SI) analysis tool, follow the PCB design guidelines, and use techniques like differential signaling, impedance matching, and signal termination.
  • The maximum bandwidth of the XCZU9EG-2FFVB1156E's PCIe interface is x16 Gen3, which is approximately 9850 MB/s.

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XCZU9EG-2FFVB1156E Overview

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