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- Part Number XCZU9EG-2FFVC900E
- Manufacturer AMD
- Pin Count 900
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - FFRB900
- Released Date Aug 30, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
XCZU9EG-2FFVC900E Details
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Manufacturer Part Number:
XCZU9EG-2FFVC900E
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
FCBGA-900
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Country Of Origin:
Taiwan
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HTS Code:
8542.31.00.60
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Factory Lead Time:
16 Weeks
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Manufacturer:
AMD
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YTEOL:
19
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JESD-30 Code:
S-PBGA-B900
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Length:
31 mm
XCZU9EG-2FFVC900E Frequently Asked Questions (FAQs)
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The maximum power consumption of the XCZU9EG-2FFVC900E is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
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The XCZU9EG-2FFVC900E has an operating temperature range of -40°C to 100°C, with a junction temperature (TJ) of up to 125°C.
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To ensure signal integrity, follow the Xilinx Signal Integrity Guidelines, use the Xilinx IBERT (Integrated Bit Error Ratio Tester) tool, and consider using the built-in signal integrity features such as transmit equalization and receive equalization.
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The XCZU9EG-2FFVC900E's PCIe interface supports up to x16 Gen3, with a maximum bandwidth of 9850 MB/s.
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XCZU9EG-2FFVC900E Overview
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