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XISOW1412DFMR - Texas Instruments

Description: ISOW14x2 5-kVRMS Reinforced Isolated RS-485/RS-422 Transceiver with Integrated Low-Emissions, Low-Noise, High-Efficiency DC-DC Converter

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XISOW1412DFMR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DFM0020A
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XISOW1412DFMR - Texas Instruments  - 3D model - Small Outline Packages - DFM0020A
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XISOW1412DFMR Details

  • Manufacturer Part Number:

    XISOW1412DFMR

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-09-06

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000025 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    12.83 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Receive Delay-Max:

    135 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    3.55 mm

  • Supply Current-Max:

    0.55 mA

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Supply Voltage1-Max:

    1.89 V

  • Supply Voltage1-Min:

    1.71 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    610 ns

  • Width:

    7.5 mm

XISOW1412DFMR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the XISOW1412DFMR datasheet, which includes a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Also, ensure proper thermal design, including a heat sink or thermal interface material, and consider derating the device's power dissipation at higher temperatures.
  • The recommended input capacitor value is 10uF to 22uF, with a low ESR (Equivalent Series Resistance) and a voltage rating of at least 25V. A ceramic or film capacitor with an X7R or X5R dielectric is recommended for optimal performance and stability.
  • To minimize EMI, follow proper PCB layout practices, such as separating analog and digital grounds, using a solid ground plane, and keeping sensitive analog signals away from noisy digital signals. Additionally, consider adding EMI filters, such as ferrite beads or common-mode chokes, to the input and output lines.
  • The recommended output capacitor value is 10uF to 47uF, with a low ESR and a voltage rating of at least 10V. A ceramic or film capacitor with an X7R or X5R dielectric is recommended for optimal performance and stability. The output capacitor should be placed close to the output pin to minimize parasitic inductance.

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XISOW1412DFMR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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