XO57CTECNA3M6864 footprint, schematic symbol and 3D model by Vishay

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XO57CTECNA3M6864 Details

The recommended land pattern for XO57CTECNA3M6864 can be found in the Vishay Intertechnologies' recommended land pattern document (document number 28356) or in the IPC-7351 standard.
During reflow soldering, ensure the component is exposed to a maximum temperature of 260°C for 30 seconds. Use a soldering profile with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds.
Yes, the XO57CTECNA3M6864 component is RoHS compliant, meaning it meets the European Union's Restriction of Hazardous Substances directive.
The MSL of the XO57CTECNA3M6864 is MSL 3, which means it can be exposed to a maximum of 168 hours at 30°C and 60% relative humidity before soldering.
While the XO57CTECNA3M6864 is a robust component, it's essential to evaluate its performance in high-vibration applications. Consult with Vishay Intertechnologies or a qualified engineer to determine the component's suitability for your specific use case.

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