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XOMAPL137BZKB3 - Texas Instruments

Description: IC MPU OMAP-L1X 375MHZ 256BGA

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PCB Footprints
XOMAPL137BZKB3 - Texas Instruments PCB footprint - BGA - BGA - ZKB (S-PBGA-N256)
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3D Models
XOMAPL137BZKB3 - Texas Instruments  - 3D model - BGA - ZKB (S-PBGA-N256)
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XOMAPL137BZKB3 Details

  • Manufacturer Part Number:

    XOMAPL137BZKB3

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

  • Pin Count:

    256

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B256

  • Number of Terminals:

    256

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

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XOMAPL137BZKB3 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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