XQ7K325T-L1RF900M - AMD

XQ7K325T-L1RF900M Details

• Manufacturer Part Number:

  XQ7K325T-L1RF900M

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-900

• Country Of Origin:

  Taiwan

• ECCN Code:

  3A001.a.2.c

• HTS Code:

  8542.31.00.60

• Manufacturer:

  AMD

• YTEOL:

  9

• Clock Frequency-Max:

  1818 MHz

• Combinatorial Delay of a CLB-Max:

  0.74 ns

• JESD-30 Code:

  S-PBGA-B900

• JESD-609 Code:

  e0

• Length:

  31 mm

• Moisture Sensitivity Level:

  4

• Number of CLBs:

  25475

• Number of Inputs:

  500

• Number of Logic Cells:

  326080

• Number of Outputs:

  500

• Number of Terminals:

  900

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -55 °C

• Package Body Material:

  PLASTIC

• Package Code:

  BGA

• Package Equivalence Code:

  BGA900,30X30,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  225

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  3.44 mm

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.95 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  HKMG

• Terminal Finish:

  Tin/Lead (Sn63Pb37)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  31 mm