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XR16V798IQ-F - MaxLinear, Inc.

Description: UART Interface IC UART

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XR16V798IQ-F - MaxLinear, Inc. - PCB symbol
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PCB Footprints
XR16V798IQ-F - MaxLinear, Inc. PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Lead QFP
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XR16V798IQ-F - MaxLinear, Inc. - 3D model - Quad Flat Packages - 100-Lead QFP
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XR16V798IQ-F Details

  • Manufacturer Part Number:

    XR16V798IQ-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    QFP-100

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    3

  • Address Bus Width:

    8

  • Boundary Scan:

    NO

  • Bus Compatibility:

    IRDA; RS-232; RS-422; RS-485

  • Clock Frequency-Max:

    64 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    1 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    3.4 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

XR16V798IQ-F Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane, separate power planes for analog and digital sections, and careful routing of high-speed signals is recommended. Consult the application note AN-215 for more details.
  • Implement thermal management techniques such as heat sinks, thermal vias, and thermal interface materials. Ensure good airflow and avoid blocking airflow around the device. Consult the thermal management application note AN-217 for more details.
  • Power sequencing should follow the recommended sequence: VCC, then VDD, then VEE. Voltage ramp-up times should be slower than 10 ms to prevent latch-up. Consult the power management application note AN-219 for more details.
  • Use a logic analyzer or oscilloscope to capture and analyze the device's signals. Consult the troubleshooting guide AN-221 for common issues and solutions. Contact MaxLinear support for further assistance.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use ESD-protective packaging, wrist straps, and mats. Follow the ESD handling and protection guidelines in the application note AN-223.

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XR16V798IQ-F Overview

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