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XR17D154IV-F - MaxLinear, Inc.

Description: UART Interface IC 3.3V-5V 64B FIFO temp -45 to 85C;UART

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XR17D154IV-F - MaxLinear, Inc. PCB footprint - Quad Flat Packages - Quad Flat Packages - (20 x 20 x 1.4 mm LQFP)
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XR17D154IV-F - MaxLinear, Inc.  - 3D model - Quad Flat Packages - (20 x 20 x 1.4 mm LQFP)
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XR17D154IV-F Details

  • Manufacturer Part Number:

    XR17D154IV-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    20 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3 V SUPPLY

  • Address Bus Width:

    32

  • Boundary Scan:

    NO

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    50 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.78125 MBps

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

XR17D154IV-F Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a 4-layer PCB stack-up with a solid ground plane, and to use thermal vias to dissipate heat. A heat sink or thermal pad can also be used to improve thermal management.
  • To optimize power consumption, use the device's power-down modes, adjust the clock frequency, and optimize the voltage regulator module (VRM) settings. Additionally, consider using a low-dropout regulator (LDO) to reduce power consumption.
  • The recommended VRM settings can be found in the datasheet, but as a general guideline, set the VRM to 1.2V for the core voltage and 1.8V for the I/O voltage. Adjust these settings based on your specific application requirements.
  • To troubleshoot JTAG issues, check the JTAG clock frequency, ensure the TCK pin is properly connected, and verify the JTAG voltage levels. Also, try using a JTAG debugger or a logic analyzer to diagnose the issue.
  • Handle the device by the body or the pins, avoid touching the pins, and use an anti-static wrist strap or mat. For ESD protection, use a device with built-in ESD protection or add external ESD protection devices, such as TVS diodes or ESD arrays.

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XR17D154IV-F Overview

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