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XR17V352IB113-F - MaxLinear, Inc.

Description: DUAL UART, 25MBPS, 3.6V, 113-BGA; No. of Channels:2 Channel; Data Rate:25Mbps; Supply Voltage Min:3V; Supply Voltage Max:3.6V; Interface Case Style:BGA; No. of Pins:113Pins; Operating Temperature Min:-40°C; Product Range:-; MSL:- RoHS Compliant: Yes

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PCB Footprints
XR17V352IB113-F - MaxLinear, Inc. PCB footprint - BGA - BGA - 113-FPBGA
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XR17V352IB113-F - MaxLinear, Inc.  - 3D model - BGA - 113-FPBGA
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XR17V352IB113-F Details

  • Manufacturer Part Number:

    XR17V352IB113-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFBGA, BGA113,11X11,32

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    5

  • Boundary Scan:

    YES

  • Bus Compatibility:

    PCI

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    312.5 MBps

  • JESD-30 Code:

    S-PBGA-N113

  • JESD-609 Code:

    e1

  • Length:

    9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of I/O Lines:

    16

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    113

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA113,11X11,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.53 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

XR17V352IB113-F Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, including keeping the device away from heat sources, using thermal vias, and ensuring good airflow. Additionally, a 4-layer PCB with a solid ground plane and a separate power plane is recommended.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal protection devices, such as thermistors or thermal fuses, to prevent overheating.
  • The recommended power sequencing is to power up the VCC supply first, followed by the VDD supply. The voltage ramp-up time should be slower than 10 ms/V to prevent latch-up and ensure reliable operation.
  • To troubleshoot and debug issues with the XR17V352IB113-F, use a logic analyzer or oscilloscope to monitor the device's signals and verify that the input and output signals meet the recommended specifications. Check the power supply voltage, clock signals, and data transmission rates to identify potential issues.
  • The XR17V352IB113-F has built-in ESD protection diodes on all pins. To prevent latch-up, ensure that the device is powered up and down slowly, and avoid applying voltage to the inputs before the power supply is stable.

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XR17V352IB113-F Overview

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