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XR33052IDTR-F - MaxLinear, Inc.

Description: Single Transmitter/Receiver RS-422/RS-485 8-Pin SOIC N T/R

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PCB Footprints
XR33052IDTR-F - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - NSOIC8
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3D Models
XR33052IDTR-F - MaxLinear, Inc.  - 3D model - Small Outline Packages - NSOIC8
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XR33052IDTR-F Details

  • Manufacturer Part Number:

    XR33052IDTR-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6.72

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.65 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transmit Delay-Max:

    1600 ns

  • Width:

    3.9 mm

XR33052IDTR-F Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, including keeping the input and output traces short and away from noise sources. Additionally, ensure good thermal management by providing adequate heat sinking and airflow around the device.
  • To optimize the XR33052IDTR-F for low power consumption, ensure that the device is operated within the recommended voltage range, and consider using the low-power mode (if available). Additionally, optimize the external component selection, such as using low-ESR capacitors, and minimize the number of external components to reduce power consumption.
  • The recommended input and output capacitors for the XR33052IDTR-F are typically X5R or X7R ceramic capacitors with a capacitance value of 10uF to 22uF. However, the optimal capacitor selection may vary depending on the specific application and operating conditions.
  • To troubleshoot common issues with the XR33052IDTR-F, start by verifying the PCB layout and component selection. Check for any signs of oscillation or instability, such as excessive noise or voltage ripple. Ensure that the input and output capacitors are properly selected and placed. If issues persist, consult the datasheet and application notes for troubleshooting guidelines.
  • The XR33052IDTR-F features thermal shutdown and overcurrent protection to prevent damage from excessive temperature or current. The thermal shutdown threshold is typically around 150°C, and the overcurrent protection threshold is typically around 2A. These features are designed to protect the device from damage and ensure reliable operation.

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XR33052IDTR-F Overview

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