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XRM42L432PZT - Texas Instruments

Description: ARM Microcontrollers - MCU CORONA F021

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XRM42L432PZT - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PZ (S-PQFP-G100
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XRM42L432PZT - Texas Instruments  - 3D model - Quad Flat Packages - PZ (S-PQFP-G100
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XRM42L432PZT Details

  • Manufacturer Part Number:

    XRM42L432PZT

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    PLASTIC, LQFP-144

  • Pin Count:

    100

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-R4

  • Clock Frequency-Max:

    100 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Number of I/O Lines:

    45

  • Number of Terminals:

    100

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    32768

  • ROM (words):

    393216

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    150 mA

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

XRM42L432PZT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the XRM42L432PZT evaluation module documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • To minimize power consumption, configure the XRM42L432PZT to use the lowest possible frequency and voltage settings for your application. Additionally, use the device's power-saving features, such as the low-power mode and dynamic voltage scaling, to reduce power consumption during idle periods.
  • The XRM42L432PZT has a maximum junction temperature of 150°C. To ensure reliable operation, provide adequate heat sinking and thermal management, such as using a heat sink or thermal pad, and ensure good airflow around the device.
  • Use the XRM42L432PZT's built-in clock monitoring and synchronization features, such as the clock monitor and synchronization status registers, to troubleshoot clocking issues. Additionally, verify that the clock input signals meet the device's specifications and that the clocking configuration is correct.
  • When using the XRM42L432PZT in a high-reliability or safety-critical application, ensure that you follow Texas Instruments' guidelines for fault-tolerant design, error detection and correction, and fault mitigation. Additionally, consider using redundant systems, error correction codes, and other safety mechanisms to ensure the reliability and integrity of your system.

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XRM42L432PZT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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