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XTHP210DGKR - Texas Instruments

Description: High precision (40-μV, 0.1μV/C), high-voltage (36-V), low-noise (3.7-nV/√Hz), fully-differential amp

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XTHP210DGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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XTHP210DGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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XTHP210DGKR Details

  • Manufacturer Part Number:

    XTHP210DGKR

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VSSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-02-19

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.004 µA

  • Bandwidth (3dB)-Nom:

    7 MHz

  • Bias Current-Max (IIB) @25C:

    0.002 µA

  • Common-mode Reject Ratio-Min:

    126 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.003 µA

  • Input Offset Voltage-Max:

    40 µV

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -2.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    15 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    9200

  • Voltage Gain-Min:

    562341.3252

  • Wideband:

    NO

  • Width:

    3 mm

XTHP210DGKR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal conductivity. A minimum of 2 oz copper thickness is recommended for the PCB.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, ensure good thermal design, including a heat sink and thermal interface material, and consider derating the device's performance at high temperatures.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 3.3V to 5V.
  • Texas Instruments recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) before applying the input signals. This ensures that the internal biasing and voltage regulators are properly initialized before the device starts operating.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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