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ZXMP10A13FQTA - Diodes Incorporated

Description: P-Channel 100 V 600mA (Ta) 625mW (Ta) Surface Mount SOT-23-3

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PCB Footprints
ZXMP10A13FQTA - Diodes Incorporated PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23_2024
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ZXMP10A13FQTA - Diodes Incorporated  - 3D model - SOT23 (3-Pin) - SOT23_2024
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ZXMP10A13FQTA Details

  • Manufacturer Part Number:

    ZXMP10A13FQTA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    0.5 A

  • Drain-source On Resistance-Max:

    1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10.8 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.625 W

  • Reference Standard:

    AEC-Q101; IATF 16949; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMP10A13FQTA Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZXMP10A13FQTA should include a solid ground plane, wide power traces, and a thermal relief pattern under the device. This helps to reduce thermal resistance and ensures reliable operation.
  • To ensure proper biasing, connect the gate to a voltage source through a suitable resistor, and ensure the drain-source voltage is within the recommended operating range. Consult the datasheet for specific biasing requirements.
  • Handle the device by the body, avoid touching the pins, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Store the device in an anti-static bag or container when not in use.
  • While the ZXMP10A13FQTA is a high-performance device, it may not meet the specific requirements for high-reliability or automotive applications. Consult with Diodes Incorporated or a qualified engineer to determine the device's suitability for your specific application.
  • The ZXMP10A13FQTA has a high power density, so thermal management is crucial. Ensure good airflow, use a heat sink if necessary, and consider thermal interface materials to reduce thermal resistance.

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ZXMP10A13FQTA Overview

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