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ZXMS81045SPQ-13 - Diodes Incorporated

Description: MOSFET High Side IntelliFET SO-8EP T&R 2.5K

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ZXMS81045SPQ-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
ZXMS81045SPQ-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8EP (Type E)
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3D Models
ZXMS81045SPQ-13 - Diodes Incorporated - 3D model - Small Outline Packages - SO-8EP (Type E)
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ZXMS81045SPQ-13 Details

  • Manufacturer Part Number:

    ZXMS81045SPQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.63 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

ZXMS81045SPQ-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZXMS81045SPQ-13 should include a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a solid ground plane to reduce thermal resistance.
  • To ensure proper biasing, the ZXMS81045SPQ-13 requires a stable input voltage (VIN) between 2.7V and 5.5V. The device also requires a bypass capacitor (CBYP) between VIN and GND to filter out noise and ensure stable operation.
  • The maximum allowed power dissipation for the ZXMS81045SPQ-13 is 1.4W. Exceeding this limit can cause the device to overheat, leading to reduced performance or even damage.
  • To protect the ZXMS81045SPQ-13 from ESD, handle the device by the body or use an anti-static wrist strap. Ensure the PCB is designed with ESD protection in mind, including the use of ESD-protection diodes and resistors.
  • The recommended operating temperature range for the ZXMS81045SPQ-13 is -40°C to 125°C. Operating the device outside this range can affect its performance and reliability.

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ZXMS81045SPQ-13 Overview

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