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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-794618-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Mating Area Plating Materi | Other | 5-794618-0 |
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4-794618-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 12 | Number of Rows 2 | Number of Positions 12 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Other | 4-794618-2 |
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3-794618-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Ar | Other | 3-794618-2 |
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4-794618-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.8 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Ho | Other | 4-794618-6 |
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2319461-8
TE Connectivity
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1 | Body Features: Product Orientation Right Angle | Configuration Features: Number of Positions 8 | Stacking Configuration Side Stackable | Number of Rows 1 | Wire Entry Angle 90° | Wire Entry Location Side | Contact Features: Contact Current Rating (Max) 5 AMP | Dimensions: Wire Size 24 – 18 AWG | Electrical Characteristics: Operating Voltage 250 VAC | Housing Features: Centerline (Pitch) 5 MM | Operation/Application: Circuit Application Power | Product Type Features: Terminal Block Connector Type Receptac | Other | 2319461-8 |
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5-794618-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Platin | Other | 5-794618-2 |
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4-794618-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 10 | Number of Positions 10 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plat | Other | 4-794618-0 |
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3-794618-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | C | Other | 3-794618-4 |
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4-794618-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 18 | PCB Mount Orientation Right Angle | Number of Positions 18 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Other | 4-794618-8 |
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5-794618-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Platin | Other | 5-794618-2 |
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1-794618-2
TE Connectivity
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1 | 12POS MICRO MNL ASSY, R/A HDR ROHS COMPLIANT: NO | Other | 1-794618-2 |
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5-794618-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Mating Area Plating Materi | Other | 5-794618-0 |
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3-794618-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | C | Other | 3-794618-4 |
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4-794618-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 14 | Number of Positions 14 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multi | Other | 4-794618-4 |
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3-794618-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | | Other | 3-794618-8 |
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3-794618-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 2 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Other | 3-794618-6 |
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4-794618-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.8 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Ho | Other | 4-794618-6 |
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3-794618-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 2 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Other | 3-794618-6 |
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4-794618-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 18 | PCB Mount Orientation Right Angle | Number of Positions 18 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Other | 4-794618-8 |
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4-794618-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 10 | Number of Positions 10 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plat | Other | 4-794618-0 |
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5-794618-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 | Other | 5-794618-4 |
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3-794618-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | | Other | 3-794618-8 |
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5-794618-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 | Other | 5-794618-4 |
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3-794618-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Ar | Other | 3-794618-2 |
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4-794618-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 14 | Number of Positions 14 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multi | Other | 4-794618-4 |
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