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MP-LE Model Download Search Results

Showing 25 of 3548 results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image 1 For Surface Mount Application in Order to Optimize Board Space\r\n• Built-in Strain Relief\r\n• Glass Passivated Junction\r\n• Plastic Package Has Underwrites Laboratory Flammability\r\n• Temperature Coefficient, Typical Value is 0.1%\r\n• Fast Response Time: Typical Less than 1ps from 0V to BV Min\r\n• Typical ID Less than 1μA Above 10V\r\n• High Temperature Soldering: 260°C/10 Seconds at Terminals\r\n• Halogen Free. “Green” Device (Note 1)\r\n• Moisture Sensitivity Level 1\r\n• Epoxy Meets UL 94 V-0 Flammability Rating\r\n• Le Diodes Moulded SMCJ20A-TP 1 Download Model
Part Image Part Image 1 For Surface Mount Application in Order to Optimize Board Space\r\n• Built-in Strain Relief\r\n• Glass Passivated Junction\r\n• Plastic Package Has Underwrites Laboratory Flammability\r\n• Temperature Coefficient, Typical Value is 0.1%\r\n• Fast Response Time: Typical Less than 1ps from 0V to BV Min\r\n• Typical ID Less than 1μA Above 10V\r\n• High Temperature Soldering: 260°C/10 Seconds at Terminals\r\n• Halogen Free. “Green” Device (Note 1)\r\n• Moisture Sensitivity Level 1\r\n• Epoxy Meets UL 94 V-0 Flammability Rating\r\n• Le Diodes Moulded SMCJ16A-TP 1 Download Model
Part Image Part Image 1 For Surface Mount Application in Order to Optimize Board Space\r\n• Built-in Strain Relief\r\n• Glass Passivated Junction\r\n• Plastic Package Has Underwrites Laboratory Flammability\r\n• Temperature Coefficient, Typical Value is 0.1%\r\n• Fast Response Time: Typical Less than 1ps from 0V to BV Min\r\n• Typical ID Less than 1μA Above 10V\r\n• High Temperature Soldering: 260°C/10 Seconds at Terminals\r\n• Halogen Free. “Green” Device (Note 1)\r\n• Moisture Sensitivity Level 1\r\n• Epoxy Meets UL 94 V-0 Flammability Rating\r\n• Le Diodes Moulded Non Polarised SMCJ11CA-TP 1 Download Model
Part Image Part Image 1 For Surface Mount Application in Order to Optimize Board Space\r\n• Built-in Strain Relief\r\n• Glass Passivated Junction\r\n• Plastic Package Has Underwrites Laboratory Flammability\r\n• Temperature Coefficient, Typical Value is 0.1%\r\n• Fast Response Time: Typical Less than 1ps from 0V to BV Min\r\n• Typical ID Less than 1μA Above 10V\r\n• High Temperature Soldering: 260°C/10 Seconds at Terminals\r\n• Halogen Free. “Green” Device (Note 1)\r\n• Moisture Sensitivity Level 1\r\n• Epoxy Meets UL 94 V-0 Flammability Rating\r\n• Le Diodes Moulded Non Polarised SMCJ51CA-TP 1 Download Model
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ISL43141IBZ-T Renesas Electronics
1 The Intersil ISL43140-ISL43142 devices are CMOS, precision, quad analog switches designed to operate from a single +2V to +12V supply or from a ±2V to ±6V supply. Targeted applications include battery powered equipment that benefit from the devices' low power consumption (1µW), low leakage currents (1nA max), and fast switching speeds (tON = 30ns, tOFF = 18ns). A 12Ω maximum RON flatness ensures signal fidelity, while channel-to-channel mismatch is guaranteed to be less than 2. 5Ω. The 3mm x 3mm Quad No- Le Small Outline Packages ISL43141IBZ-T 1 Download Model
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EL7156CSZ-T7A Renesas Electronics
1 The EL7156 high performance pin driver with three-state is suited to many ATE and level-shifting applications. The 3. 5A peak drive capability makes this part an excellent choice when driving high capacitance loads. The output pin OUT is connected to input pins VH or VL respectively, depending on the status of the IN pin. When the OE pin is active low, the output is placed in the three-state mode. The isolation of the output FETs from the power supplies enables VH and VL to be set independently, enabling le Small Outline Packages EL7156CSZ-T7A 1 Download Model
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MP-LED-18.3-STG8U MPE-Garry GmbH
1 IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-18.3-STG8U 0 Build or Request
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MP-LED-10.3-STGU MPE-Garry GmbH
1 IC Socket, DIP10, 10 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-10.3-STGU 0 Build or Request
Part Image Part Image
MP-LED-08.3-STG8U MPE-Garry GmbH
1 IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-08.3-STG8U 0 Build or Request
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MP-LED-10.2-STG8U MPE-Garry GmbH
1 IC Socket, DIP10, 10 Contact(s), 2.54mm Term Pitch, 0.2inch Row Spacing, Solder MP-LED-10.2-STG8U 0 Build or Request
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MP-LED-10.2-STGU MPE-Garry GmbH
1 IC Socket, DIP10, 10 Contact(s), 2.54mm Term Pitch, 0.2inch Row Spacing, Solder MP-LED-10.2-STGU 0 Build or Request
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MP-LED-32.6-STG8U MPE-Garry GmbH
1 IC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder MP-LED-32.6-STG8U 0 Build or Request
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MP-LED-32.6-STGU MPE-Garry GmbH
1 IC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder MP-LED-32.6-STGU 0 Build or Request
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MP-LED-28.6-STG8U MPE-Garry GmbH
1 IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder MP-LED-28.6-STG8U 0 Build or Request
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MP-LED-40.6-STG8U MPE-Garry GmbH
1 IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder MP-LED-40.6-STG8U 0 Build or Request
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MP-LED-06.3-STG8U MPE-Garry GmbH
1 IC Socket, DIP6, 6 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-06.3-STG8U 0 Build or Request
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MP-LED-40.6-STGU MPE-Garry GmbH
1 IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder MP-LED-40.6-STGU 0 Build or Request
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MP-LED-18.3-STGU MPE-Garry GmbH
1 IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-18.3-STGU 0 Build or Request
Part Image Part Image
MP-LED-28.6-STGU MPE-Garry GmbH
1 IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder MP-LED-28.6-STGU 0 Build or Request
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MP-LED-24.6-STGU MPE-Garry GmbH
1 IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder MP-LED-24.6-STGU 0 Build or Request
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MP-LED-14.3-STGU MPE-Garry GmbH
1 IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-14.3-STGU 0 Build or Request
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MP-LED-08.3-STGU MPE-Garry GmbH
1 IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-08.3-STGU 0 Build or Request
Part Image Part Image
MP-LED-14.3-STG8U MPE-Garry GmbH
1 IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-14.3-STG8U 0 Build or Request
Part Image Part Image
MP-LED-24.3-STGU MPE-Garry GmbH
1 IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-24.3-STGU 0 Build or Request
Part Image Part Image
MP-LED-20.3-STG8U MPE-Garry GmbH
1 IC Socket, DIP20, 20 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder MP-LED-20.3-STG8U 0 Build or Request
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