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R7FA4M1AB3CNE#AC0
Renesas Electronics
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1 | The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc | Quad Flat No-Lead | R7FA4M1AB3CNE#AC0 |
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R7FA4M3AF3CFM#BA0
Renesas Electronics
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1 | The Renesas RA4M3 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M3 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M3 is suitable for IoT applications requiring vast communication options, futur | Quad Flat Packages | R7FA4M3AF3CFM#BA0 |
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R7FA4M3AE3CFM#AA0
Renesas Electronics
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1 | The Renesas RA4M3 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M3 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M3 is suitable for IoT applications requiring vast communication options, futur | Quad Flat Packages | R7FA4M3AE3CFM#AA0 |
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R7FA4M1AB2CLJ#AC0
Renesas Electronics
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1 | The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc | BGA | R7FA4M1AB2CLJ#AC0 |
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R7FA4M1AB3CNB#BA0
Renesas Electronics
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1 | The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc | Quad Flat No-Lead | R7FA4M1AB3CNB#BA0 |
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R7FA4M2AC3CFP#BA0
Renesas Electronics
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1 | The Renesas RA4M2 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M2 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M2 is suitable for IoT applications requiring vast communication options, futur | Quad Flat Packages | R7FA4M2AC3CFP#BA0 |
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R7FA4M1AB3CNE#AA0
Renesas Electronics
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1 | The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc | Quad Flat No-Lead | R7FA4M1AB3CNE#AA0 |
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R7FA6M5AH3CFP#BA0
Renesas Electronics
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1 | The Renesas RA6M5 group uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the Secure Crypto Engine it offers Secure Element functionality. The integrated Ethernet MAC with individual DMA ensures high data throughput. The RA6M5 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M5 is suitable for IoT applications | Quad Flat Packages | R7FA6M5AH3CFP#BA0 |
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72V273L7-5BCGI8
Renesas Electronics
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1 | The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes. | BGA | 72V273L7-5BCGI8 |
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R7FA6M5AH3CFP#AA0
Renesas Electronics
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1 | The Renesas RA6M5 group uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the Secure Crypto Engine it offers Secure Element functionality. The integrated Ethernet MAC with individual DMA ensures high data throughput. The RA6M5 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M5 is suitable for IoT applications | Quad Flat Packages | R7FA6M5AH3CFP#AA0 |
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R7FA6M3AF3CFP#HA0
Renesas Electronics
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1 | The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm? Cortex?-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept?the Flexible Software Package (FSP), built on FreeRTOS?and is expandable to use other RTOSes and middl | Quad Flat Packages | R7FA6M3AF3CFP#HA0 |
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R7FA4M1AB3CFL#BA0
Renesas Electronics
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1 | The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc | Quad Flat Packages | R7FA4M1AB3CFL#BA0 |
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R7FA6M3AH3CLK#AC0
Renesas Electronics
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1 | The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middl | BGA | R7FA6M3AH3CLK#AC0 |
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R7FA6M5BF3CFC#BA0
Renesas Electronics
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1 | The Renesas RA6M5 group uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the Secure Crypto Engine it offers Secure Element functionality. The integrated Ethernet MAC with individual DMA ensures high data throughput. The RA6M5 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M5 is suitable for IoT applications | Quad Flat Packages | R7FA6M5BF3CFC#BA0 |
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72V2103L6PFG8
Renesas Electronics
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1 | The 72V2103 256K x 9/128K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes. | Quad Flat Packages | 72V2103L6PFG8 |
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SSCSNBN600LD2A3
Honeywell
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1 | TRUSTABILITY PRESSURE SENSOR | Other | SSCSNBN600LD2A3 |
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SSCDJNN100PGAA5
Honeywell
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1 | TRUSTABILITY PRESSURE SENSOR | Other | SSCDJNN100PGAA5 |
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HSCDANN010BAAA5
Honeywell
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1 | Board Mount Pressure Sensors | Dual-In-Line Packages | HSCDANN010BAAA5 |
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MS583702BA21-50
TE Connectivity
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1 | Board Mount Pressure Sensors | Other | MS583702BA21-50 |
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MPS-3117-006GC
Metrodyne Microsystem Corp
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0 | MPS-3110 series Pressure Sensor | Other | MPS-3117-006GC |
2
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SP370251160XTMA3
Infineon
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1 | Board Mount Pressure Sensors TPMS & INERTIA | Small Outline Packages | SP370251160XTMA3 |
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EFR32FG23A010F512GM40-B
Silicon Labs
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1 | RF System on a Chip - SoC FG23, Sub-GHz, 512kB Flash, 64kB RAM, +14 dBm, QFN40 | Quad Flat No-Lead | EFR32FG23A010F512GM40-B |
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MP3V5010GC6T1
NXP
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1 | Board Mount Pressure Sensors SMALL OUTLINE SMT | Small Outline Packages | MP3V5010GC6T1 |
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FDPC1012S_T
onsemi
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1 | ON Semiconductor | Other | FDPC1012S_T |
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5420E-030-A-P-S
Silicon Microstructures, Inc.
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1 | Board Mount Pressure Sensors | Small Outline Packages | 5420E-030-A-P-S |
3
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