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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	EFR32FG23A010F512GM40-B Silicon Labs	1	RF System on a Chip - SoC FG23, Sub-GHz, 512kB Flash, 64kB RAM, +14 dBm, QFN40	Quad Flat No-Lead	EFR32FG23A010F512GM40-B	3D model available Symbol and footprint available 3	1 Download Model
	72V273L7-5PFGI Renesas Electronics	1	The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	Quad Flat Packages	72V273L7-5PFGI	3D model available Symbol and footprint available 3	1 Download Model
	72V263L6BCG8 Renesas Electronics	1	The 72V263 16K x 9/8K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	BGA	72V263L6BCG8	3D model available Symbol and footprint available 3	1 Download Model
	72V273L10PFG8 Renesas Electronics	1	The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	Quad Flat Packages	72V273L10PFG8	3D model available Symbol and footprint available 3	1 Download Model

	R7FA6M5BF3CFC#BA0 Renesas Electronics	1	The Renesas RA6M5 group uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the Secure Crypto Engine it offers Secure Element functionality. The integrated Ethernet MAC with individual DMA ensures high data throughput. The RA6M5 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M5 is suitable for IoT applications	Quad Flat Packages	R7FA6M5BF3CFC#BA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M1AB2CLJ#AC0 Renesas Electronics	1	The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc	BGA	R7FA4M1AB2CLJ#AC0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA6M3AF3CFP#HA0 Renesas Electronics	1	The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm? Cortex?-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept?the Flexible Software Package (FSP), built on FreeRTOS?and is expandable to use other RTOSes and middl	Quad Flat Packages	R7FA6M3AF3CFP#HA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M1AB3CNE#AC0 Renesas Electronics	1	The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc	Quad Flat No-Lead	R7FA4M1AB3CNE#AC0	3D model available Symbol and footprint available 3	1 Download Model
	72V293L7-5BC Renesas Electronics	1	The 72V293 128K x 9/64K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	BGA	72V293L7-5BC	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M3AE3CFM#AA0 Renesas Electronics	1	The Renesas RA4M3 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M3 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M3 is suitable for IoT applications requiring vast communication options, futur	Quad Flat Packages	R7FA4M3AE3CFM#AA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA6M5AH3CFP#AA0 Renesas Electronics	1	The Renesas RA6M5 group uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the Secure Crypto Engine it offers Secure Element functionality. The integrated Ethernet MAC with individual DMA ensures high data throughput. The RA6M5 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M5 is suitable for IoT applications	Quad Flat Packages	R7FA6M5AH3CFP#AA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M1AB3CNB#BA0 Renesas Electronics	1	The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc	Quad Flat No-Lead	R7FA4M1AB3CNB#BA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA6M5AG2CBG#BC0 Renesas Electronics	1	The Renesas RA6M5 group uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the Secure Crypto Engine it offers Secure Element functionality. The integrated Ethernet MAC with individual DMA ensures high data throughput. The RA6M5 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M5 is suitable for IoT applications	BGA	R7FA6M5AG2CBG#BC0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA6M1AD3CFP#BA0 Renesas Electronics	1	The Renesas RA6M1 microcontroller is the entry point to the Renesas RA6 product series for applications that require a high-performance Arm® Cortex®-M4 core at a very attractive price point. The RA6M1 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M1 is suitable for IoT applications requiring security, large embedded RAM and low power con	Quad Flat Packages	R7FA6M1AD3CFP#BA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M1AB3CFM#HA0 Renesas Electronics	1	The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc	Quad Flat Packages	R7FA4M1AB3CFM#HA0	3D model available Symbol and footprint available 3	1 Download Model

	R7FA6M2AF3CLK#AC0 Renesas Electronics	1	The Renesas RA6M2 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers Ethernet MAC with individual DMA, to ensure high data throughput. The RA6M2 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M2 is suitable for IoT applications requiring Ethernet, security, large embedded RAM, and low active power c	BGA	R7FA6M2AF3CLK#AC0	3D model available Symbol and footprint available 3	1 Download Model
	72V253L7-5BCI Renesas Electronics	1	The 72V253 8K x 9/4K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	BGA	72V253L7-5BCI	3D model not available Symbol and footprint available 2	1 Download Model
	R7FA4M2AB3CFP#AA0 Renesas Electronics	1	The Renesas RA4M2 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M2 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M2 is suitable for IoT applications requiring vast communication options, futur	Quad Flat Packages	R7FA4M2AB3CFP#AA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M2AB3CFL#AA0 Renesas Electronics	1	The Renesas RA4M2 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M2 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M2 is suitable for IoT applications requiring vast communication options, futur	Quad Flat Packages	R7FA4M2AB3CFL#AA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA6M3AH3CFB#BA0 Renesas Electronics	1	The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middl	Quad Flat Packages	R7FA6M3AH3CFB#BA0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M3AE2CBQ#BC0 Renesas Electronics	1	The Renesas RA4M3 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M3 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M3 is suitable for IoT applications requiring vast communication options, futur	BGA	R7FA4M3AE2CBQ#BC0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M2AC3CFP#BA0 Renesas Electronics	1	The Renesas RA4M2 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. In concert with the secure crypto engine, it offers secure element functionality. The RA4M2 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M2 is suitable for IoT applications requiring vast communication options, futur	Quad Flat Packages	R7FA4M2AC3CFP#BA0	3D model available Symbol and footprint available 3	1 Download Model
	72V273L7-5BCGI Renesas Electronics	1	The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	BGA	72V273L7-5BCGI	3D model available Symbol and footprint available 3	1 Download Model
	R7FA6M3AF3CFP#AA0 Renesas Electronics	1	The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middl	Quad Flat Packages	R7FA6M3AF3CFP#AA0	3D model available Symbol and footprint available 3	1 Download Model
	72V273L7-5PFGI8 Renesas Electronics	1	The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	Quad Flat Packages	72V273L7-5PFGI8	3D model available Symbol and footprint available 3	1 Download Model
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