202K2 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	MAPD-011020 MACOM	1	Signal Conditioning 2 way 0 degree power divider.	Other	MAPD-011020	3D model available Symbol and footprint available 3	1 Download Model
	HRL3024S1K0P XP POWER	1	Isolated DC/DC Converters 30W 0 to 1000V 1.5A	Other	HRL3024S1K0P	3D model available Symbol and footprint available 3	1 Download Model
	LM1875T/LF02 Texas Instruments	1	Audio Amplifiers 20-W Audio Power Amplifier 5-TO-220 0 to 70	Other	LM1875T/LF02	3D model not available Symbol and footprint available 2	1 Download Model
	LTSR 6-NP LEM	1	LEM LTSR Series Closed Loop Current Sensor, 0 → ±19.2A	Other	LTSR 6-NP	3D model available Symbol and footprint available 3	1 Download Model

	1744428-3 TE Connectivity	1	Configuration Features: PCB Mount Orientation Right Angle \| Number of Power Positions 3 \| Number of Signal Positions 0 \| Number of Positions 3 \| Number of Rows 1 \| Contact Features: Contact Type Pin \| PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 80 MICIN \| Contact Layout Inline \| Contact Mating Area Plating Material Thickness 2.03 MICM \| Contact Mating Area Plating Material Tin \| Contact Base Material Brass \| Mating Post Length 8.6 MM \| Contact Retention	Other	1744428-3	3D model available Symbol and footprint available 3	1 Download Model
	2029150-3 TE Connectivity	1	Configuration Features: Number of Positions 3 \| PCB Mount Orientation Right Angle \| Number of Rows 1 \| Number of Signal Positions 0 \| Number of Power Positions 3 \| Contact Features: Contact Retention Within Housing Without \| Contact Layout Inline \| Contact Current Rating (Max) 9 AMP \| Contact Type Pin \| PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Tin \| Dimensions: Compatible Insulation Diameter Range .047 â€“ .122 INCH \| Compatible Insulation Diameter Range 1.2 â	Other	2029150-3	3D model available Symbol and footprint available 3	1 Download Model
	179846-1 TE Connectivity	1	Configuration Features: Number of Signal Positions 0 \| PCB Mount Orientation Vertical \| Number of Power Positions 3 \| Number of Positions 3 \| Number of Rows 1 \| Contact Features: Contact Mating Area Plating Material Thickness 1 MICM \| PCB Contact Termination Area Plating Material Tin \| PCB Contact Termination Area Plating Material Thickness 39.37 MICIN \| Contact Mating Area Plating Material Thickness 39.37 MICIN \| Contact Type Tab \| Contact Layout Inline \| Contact Current Rating (Max) 14 AMP \| PCB Contact T	Other	179846-1	3D model available Symbol and footprint available 3	1 Download Model
	Q04CT-12 XP POWER	1	XP Power Q04CT-12 DC to High Voltage DC Converter 0 → 12 V dc 1.25mA 0 → ±200V dc	Other	Q04CT-12	3D model available Symbol and footprint available 3	1 Download Model
	REF5025AIDGKR Texas Instruments	1	3 µVpp/V Noise, 3 ppm/°C Drift Precision Series Voltage Reference	Small Outline Packages	REF5025AIDGKR	3D model available Symbol and footprint available 3	1 Download Model
	STM708RM6F STMicroelectronics	1	3 V Supervisor	Small Outline Packages	STM708RM6F	3D model available Symbol and footprint available 3	1 Download Model
	STM706RDAM6F STMicroelectronics	1	3 V Supervisor	Small Outline Packages	STM706RDAM6F	3D model available Symbol and footprint available 3	1 Download Model
	STM706TAM6F STMicroelectronics	1	3 V Supervisor	Small Outline Packages	STM706TAM6F	3D model available Symbol and footprint available 3	1 Download Model
	TLE7183QUXUMA9 Infineon	1	3 Phase Driver IC	Quad Flat Packages	TLE7183QUXUMA9	3D model available Symbol and footprint available 3	1 Download Model
	STM706RAM6F STMicroelectronics	1	3 V Supervisor	Small Outline Packages	STM706RAM6F	3D model available Symbol and footprint available 3	1 Download Model
	S03B-PASK-2 (LF) (SN) JST (JAPAN SOLDERLESS TERMINALS)	1	3 way side entry PCB header PA 2.0 JST Polyamide Series, 2mm Pitch 3 Way 1 Row Right Angle PCB Header, Solder Termination, 3A	Other	S03B-PASK-2 (LF) (SN)	3D model available Symbol and footprint available 3	1 Download Model

	DSPIC33CK256MP202T-I/2N Microchip	1	Digital Signal Processors & Controllers - DSP, DSC 16 Bit DSC, 256KB Flash, 24KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG	Other	DSPIC33CK256MP202T-I/2N	3D model available Symbol and footprint available 3	1 Download Model
	DSPIC33CK256MP503-I/M5 Microchip	1	Digital Signal Processors & Controllers - DSP, DSC 16 Bit DSC, 256KB Flash, 24KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG, CAN-FD	Other	DSPIC33CK256MP503-I/M5	3D model not available Symbol and footprint available 2	1 Download Model
	MIC803-30D3VM3TR Microchip	1	3 Pin Microprocessor Supervisor Circuit	SOT23 (3-Pin)	MIC803-30D3VM3TR	3D model available Symbol and footprint available 3	1 Download Model
	TSW-103-24-F-S-LL SAMTEC	1	CONN HEADER 3 POS .100"	Header, Vertical	TSW-103-24-F-S-LL	3D model available Symbol and footprint available 3	1 Download Model
	8744884 RS Pro	0	5.0mm Header Horizontal 3 way	Header, Shrouded - Right Angle PTH Box	8744884	3D model available Symbol and footprint available 3	1 Download Model
	EPC2108 EPC	1	GANFET 3 N-CH 60V/100V 9BGA	Other	EPC2108	3D model available Symbol and footprint available 3	1 Download Model
	LN60A01ES-LF Monolithic Power Systems (MPS)	1	MOSFET 600V, 3 N-Channel FET	Small Outline Packages	LN60A01ES-LF	3D model available Symbol and footprint available 3	1 Download Model
	TSW-101-07-G-T SAMTEC	1	CONN HEADER 3 POS .100"	Header, Vertical	TSW-101-07-G-T	3D model available Symbol and footprint available 3	1 Download Model
	5223955-2 TE Connectivity	1	Configuration Features: Number of Power Positions 3 \| PCB Mount Orientation Vertical \| Number of Rows 0 \| Number of Positions 3 \| Number of Signal Positions 1 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold \| Contact Underplating Material Nickel \| Contact Base Material Phosphor Bronze \| Contact Mating Area Plating Material Gold Flash over Palladium Nickel \| Contact Retention Within Hou	Other	5223955-2	3D model available Symbol and footprint available 3	1 Download Model
	6650383-1 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: Number of Power Positions 6 \| Mating & Unmating Configuration Hot Pluggable \| Number of Positions 6 \| PCB Mount Orientation Vertical \| Number of Signal Positions 0 \| Number of Dual Positions 3 \| Contact Features: Power Contact Base Material Phosphor Bronze Alloy \| Contact Base Material Phosphor Bronze \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Pl	Other	6650383-1	3D model available Symbol and footprint available 3	1 Download Model
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