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1612050-9
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Rows 2 | Number of Sections 1 | Number of Positions 32 | PCB Mount Orientation Right Angle | Number of Signal Positions 32 | Contact Features: Mating Tab Thickness .64 MM | Contact Mating Area Plating Material Tin (Sn) | Contact Type Tab | Mating Tab Width .025 INCH | Mating Tab Width .64 MM | Contact Mating Area Plating Material Gold (Au) | Mating Tab Thickness .025 INCH | Dimensions: Profile Height from PCB .394 INCH | PCB Th | Other | 1612050-9 |
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292161-2
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Current Rating (Max) 4 AMP | Contact Mating Area Plating Material Thickness 39.37 – 78.73 MICIN | Contact Type Pin | Contact Mating Area Length .177 INCH | PCB Contact Termination Area Plating Material Thickness 1 – 2 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 39 | Header, Shrouded - Straight PTH Box | 292161-2 |
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SLP2161292G
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, Male, Pitch 2.54mm, for PCB depth ?; 1.6, 2 Position | Other | SLP2161292G |
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MSP430F1612IPMR
Texas Instruments
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1 | 16-bit Ultra-Low-Power MCU, 55kB Flash, 5120B RAM, 12-Bit ADC, Dual DAC, 2 USART, I2C, HW Mult, DMA | Quad Flat Packages | MSP430F1612IPMR |
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SLB9672XU20FW1612XTMA1
Infineon
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1 | Optimized TPM device for IoT and ICT applications• PQC-protected firmware update mechanism• Compliant to TPM Main Specification, Family "2.0", Level 00, Revision 01.59• Certifications:– CC, Version 3.1 Rev.5, level EAL4+, AVA_VAN.4 (moderate) according to TCG PC Client TPM ProtectionProfile– FIPS 140-2 level 2 (physical security level 3) (targeted)• SPI interface• Meeting Intel TXT and Microsoft Windows certification criteria for successful platform qualification• Random Number Generator ( | Quad Flat No-Lead | SLB9672XU20FW1612XTMA1 |
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74LVX161284MTDX
onsemi
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1 | Flow-through pin configuration allows easy interface between the "Peripheral and Host"; Translation capability allows outputs on the cable side to interface with 5V signals; B and Y outputs in high impedance mode during power down; Inputs and outputs on cable side have internal pull-up resistors; Replaces the function of two (2) 74ACT1284 devices; All inputs have hysteresis to provide noise margin; Supports IEEE 1284 Level 1 and Level 2 signaling standards for bidirectional parallel communications between p | Small Outline Packages | 74LVX161284MTDX |
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231-612/023-000
Wago
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1 | PCB terminal block; 2.5 mm²; Pin spacing 5 mm; 12-pole; CAGE CLAMP®; clamping collar | Other | 231-612/023-000 |
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231-612/017-000
Wago
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1 | PCB terminal block; 2.5 mm²; Pin spacing 5 mm; 12-pole; CAGE CLAMP®; clamping collar | Other | 231-612/017-000 |
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686316124422
Würth Elektronik
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1 | WURTH ELEKTRONIK - 686316124422 - CONNECTOR, FPC, ZIF, 16POS, 1MM | Other | 686316124422 |
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AXE-516124
Panasonic
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1 | Board to Board & Mezzanine Connectors Socket 0.4mm,16-pin w/o positioning boss | Other | AXE-516124 |
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HTSW-116-12-H-T-RA
SAMTEC
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1 | SAMTEC - HTSW-116-12-H-T-RA - HEADER, 2.54MM, THT, R/A, 48WAY | Header, Unshrouded - Right Angle PTH Pin | HTSW-116-12-H-T-RA |
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AXF-5D1612
Panasonic
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1 | Board to Board & Mezzanine Connectors 16 pins Socket 5.30x2.2x0.59mm | Other | AXF-5D1612 |
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031-6121
Amphenol
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1 | RF Connectors / Coaxial Connectors RIGHT ANGLE PC JACK | Other | 031-6121 |
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MAX11612EUA+
Analog Devices
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1 | Analog to Digital Converters - ADC 2.7V to 3.6V and 4.5V to 5.5V, Low-Power, 4-/8-/12-Channel, 2-Wire Serial 12-Bit ADCs | Small Outline Packages | MAX11612EUA+ |
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DSEC16-12AS
LITTELFUSE
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1 | Diode Array 1 Pair Common Cathode 1200 V 10A Surface Mount TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | Other | DSEC16-12AS |
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PIC12F1612-I/SN
Microchip
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1 | 8-bit Microcontrollers - MCU 3.5KB Flash,256 RAM 32MHz Int. Osc | Small Outline Packages | PIC12F1612-I/SN |
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1 | Standard Clock Oscillators 26MHz CMOS 1.6-3.6V | Other | ECS-1612MV-260-CN-TR |
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IS43TR16128C-15HBL
Integrated Silicon Solution Inc.
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1 | DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin TW-BGA | BGA | IS43TR16128C-15HBL |
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1 | Crystals CRYSTAL 26MHZ 8PF SMD | Other | NX1612AA-26MHZ-STD-CSI-1 |
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SN74LVC161284DGGR
Texas Instruments
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1 | 19-Bit Bus Interface With 3-State Outputs | Small Outline Packages | SN74LVC161284DGGR |
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MAX16126TCA+
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - MAX16126TCA+ - Voltage Supervisor, 3V-30V supply, Open-Drain reset, 1.225V threshold, TQFN-12 | Quad Flat No-Lead | MAX16126TCA+ |
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LDC1612
Texas Instruments
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1 | The LDC1612 and LDC1614 are 2- and 4-channel, 28-bit inductance to digital converters (LDCs) for inductive sensing solutions. | Small Outline No-lead | LDC1612 |
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IS43TR16128DL-107MBL
Integrated Silicon Solution Inc.
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1 | DRAM 2G 128Mx16 1866MT/s 1.35V DDR3L | BGA | IS43TR16128DL-107MBL |
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OPA1612AID
Texas Instruments
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1 | Audio Amplifiers 1.1nV Noise Low Pwr Prec Op Amp | Small Outline Packages | OPA1612AID |
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IS43TR16128C-15HBLI-TR
Integrated Silicon Solution Inc.
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1 | DRAM 2G, 1.5V, DDR3, 128Mx16, 1333MT/s a. 9-9-9, 96 ball BGA (9mm x13mm) RoHS, IT, T&R | BGA | IS43TR16128C-15HBLI-TR |
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![Part Image](["https://www.te.com/catalog/common/images/PartImages/pr1612050.jpg","https://www.te.com/catalog/common/images/PartImages/pr1612050.jpg",null])
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