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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	CRCW2512127KFKEG Vishay	1	Standard Thick Film Chip Resistors value 127K ohm.	Resistor Chip	CRCW2512127KFKEG	3D model available Symbol and footprint available 3	1 Download Model
	418121270802 Würth Elektronik	1	SWITCH SLIDE DIP SPST 25MA 24V	Other	418121270802	3D model not available Symbol and footprint available 2	1 Download Model
	LFSPXO021270 IQD	1	IQD FREQUENCY PRODUCTS - LFSPXO021270 - Oscillator, 24 MHz, 50 ppm, SMD, 7mm x 5mm, 3.3 V, CFPS-73 Series	Other	LFSPXO021270	3D model available Symbol and footprint available 3	1 Download Model
	LFXTAL021277BULK IQD	1	Crystals 14.31818MHz 16pF -10C 60C	Other	LFXTAL021277BULK	3D model available Symbol and footprint available 3	1 Download Model

	418121270804 Würth Elektronik	1	Dip Switch SPST 4 Position Surface Mount Slide (Standard) Actuator 25mA 24VDC	Other	418121270804	3D model available Symbol and footprint available 3	1 Download Model
	418121270806 Würth Elektronik	1	DIP Switches / SIP Switches	Other	418121270806	3D model available Symbol and footprint available 3	1 Download Model
	R5F21276SNFP#U0 Renesas Electronics	1	RENESAS - R5F21276SNFP#U0 - Microcontroller, R8C Family R8C/1x Series Microcontrollers, R8C, 16bit, 20 MHz, 32 KB, 1.5 KB	Quad Flat Packages	R5F21276SNFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	8579-0-15-15-21-27-10-0 Mill-Max	1	MILL MAX - 8579-0-15-15-21-27-10-0 . - IC & Component Socket, 1 Contacts, PCB Socket, 8579 Series, Beryllium Copper	Other	8579-0-15-15-21-27-10-0	3D model available Symbol and footprint available 3	1 Download Model
	418121270812 Würth Elektronik	1	DIP Switches/SIP Switches WS-DITV Dip Sw 12Pin Horiz Box Typ Black	Other	418121270812	3D model not available Symbol and footprint available 2	1 Download Model
	R5F21274SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	IR2127PBF Infineon	1	International Rectifier IR2127PBF, MOSFET Power Driver 0.5A, 10 → 20 V, Non-Inverting, 8-Pin PDIP	Dual-In-Line Packages	IR2127PBF	3D model available Symbol and footprint available 3	1 Download Model
	IRS2127SPBF Infineon	1	INFINEON - IRS2127SPBF - Current Sensor, Bootstrap Operation, 60 µA, SOIC, 8 Pins, 10 V, 20 V	Small Outline Packages	IRS2127SPBF	3D model available Symbol and footprint available 3	1 Download Model

	09662127601 HARTING	1	D-Sub 15pin female angled 2.54mm pitch, stamped, w/o board locks, M3, PL3	Other	09662127601	3D model available Symbol and footprint available 3	1 Download Model
	R5F21276SDFP#V2 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21276SDFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	ABM7-13.52127MHZ-10-R50-D4Q-T ABRACON	1	CERAMIC SMD MICRO MINIATURE MICROPROCESSOR CRYSTAL	Other	ABM7-13.52127MHZ-10-R50-D4Q-T	3D model available Symbol and footprint available 3	1 Download Model
	TSW-121-27-S-S SAMTEC	1	21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-121-27-S-S	3D model not available Symbol and footprint available 2	1 Download Model
	AXE512127 Panasonic	1	Panasonic A4S Series 0.4mm Pitch 12 Way 2 Row PCB Socket, Surface Mount, Solder Termination	Other	AXE512127	3D model available Symbol and footprint available 3	1 Download Model
	RA30H2127M1 Mitsubishi	1	RoHS Compliance, 210-275MHz 30W 12.5V, 2 Stage Amp. For Mobile Radion	Other	RA30H2127M1	3D model available Symbol and footprint available 3	1 Download Model
	CRCW0402127KFKED Vishay	1	Vishay CRCW Series Thick Film Surface Mount Resistor 402 Case 127kΩ ±1% 0.063W ±100ppm/°C	Resistor Chip	CRCW0402127KFKED	3D model available Symbol and footprint available 3	1 Download Model
	CRCW2512127KFKEG Vishay	1	Standard Thick Film Chip Resistors value 127K ohm.	Resistor Chip	CRCW2512127KFKEG	3D model available Symbol and footprint available 3	1 Download Model
	CRCW0402127KFKTD Vishay	1	Thick Film Resistors - SMD 1/16watt 127Kohms 1%	Resistor Chip	CRCW0402127KFKTD	3D model available Symbol and footprint available 3	1 Download Model
	MAL202127471E3 Vishay	1	Aluminum Electrolytic Capacitors - Axial Leaded 470uF 40V 20% Axial	Capacitors, Polarized Axial Diameter Horizontal Mounting	MAL202127471E3	3D model available Symbol and footprint available 3	1 Download Model
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