212-9 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	RM352-059-321-2900 AirBorn	1	Rectangular MIL Spec Connectors R-Series .075	Other	RM352-059-321-2900	3D model not available Symbol and footprint available 2	1 Download Model
	TS16-1212-95-BK-260-SMT-TR CUI Devices	0	Tactile Switches 12 x 12 mm 9.5 mm Actuactor Height 260gf Black Surface Mount TR SPST	Other	TS16-1212-95-BK-260-SMT-TR	3D model available Symbol and footprint available 3	1 Download Model
	RM312-011-121-2900 AirBorn	1	3 Row Straight PTH PCB Connector with Mounting Ears (PLUG)	Other	RM312-011-121-2900	3D model not available Symbol and footprint available 2	1 Download Model
	R5F21294SDSP#W4 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21294SDSP#W4	3D model available Symbol and footprint available 3	1 Download Model

	TSW-121-29-S-S SAMTEC	1	21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-121-29-S-S	3D model not available Symbol and footprint available 2	1 Download Model
	242-1293-29-0602J 3M	1	IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.	Other	242-1293-29-0602J	3D model not available Symbol and footprint available 2	1 Download Model
	RM212-020-121-2900 AirBorn	1	Rectangular MIL Spec Connectors CONNECTOR, R SERIES	Other	RM212-020-121-2900	3D model available Symbol and footprint available 3	1 Download Model
	PCF2129AT NXP	1	NXP Semiconductors Accurate RTC with integrated quartz crystal for industrial applications	Small Outline Packages	PCF2129AT	3D model available Symbol and footprint available 3	1 Download Model
	2-2129710-5 TE Connectivity	1	Body Features: Frame Style C Shape \| Configuration Features: Number of Positions 1824 \| Grid Spacing .9906 x .8585 MM \| Grid Spacing .039 x .0338 INCH \| Contact Features: IC Socket Type LGA 3647 \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Gold \| Contact Base Material Copper Alloy \| Contact Mating Area Plating Material Thickness 30 MICIN \| Housing Features: Centerline (Pitch) .86 MM \| Centerline (Pitch) .99 MM \| Housing Color Black \| Centerline (Pitch) .039 INCH \| Housing Mat	Other	2-2129710-5	3D model available Symbol and footprint available 3	1 Download Model
	TSW-121-29-SS-S SAMTEC	1	21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-121-29-SS-S	3D model not available Symbol and footprint available 2	1 Download Model
	1821290 Phoenix Contact	1	PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, Number of potentials: 7, Number of rows: 1, Number of positions per row: 7, number of connections: 7, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: MICRO COMBICON - FMC 0,5, Locking: without, type of packaging: 44 mm wide tape, Sample values available unde	Other	1821290	3D model available Symbol and footprint available 3	1 Download Model
	830202129201 Würth Elektronik	1	Standard 7 x 5mm crystal oscillator in a ceramic package with a seam sealed metal lid, hermetically sealed	Other	830202129201	3D model available Symbol and footprint available 3	1 Download Model
	PCA2129T/Q900/2,51 NXP	1	Real Time Clock RTC IC	Small Outline Packages	PCA2129T/Q900/2,51	3D model available Symbol and footprint available 3	1 Download Model
	232-1291-00-0602J 3M	1	3M 2321291 1.78mm Pitch Straight 32 Way, Through Hole ZIF IC Dip Socket, 1A	Other	232-1291-00-0602J	3D model available Symbol and footprint available 3	1 Download Model
	SSSS212901 ALPS Electric	1	Switch Slide SP3T Top Slide 0.3A 6VDC 10000Cycles Gull Wing SMD T/R	Other	SSSS212901	3D model available Symbol and footprint available 3	1 Download Model

	RM372-035-321-2900 AirBorn	1	RM37, Rugged Rectangular Connector, 1.91mm Pitch, Right Angle Board Mount Plug, PTH, without Mounting Ears. 3-Row, Size: 035.	Other	RM372-035-321-2900	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-121-29-LM-S SAMTEC	1	21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-121-29-LM-S	3D model not available Symbol and footprint available 2	1 Download Model
	R5F21292SNSP#W4 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	RM222-010-221-2900 AirBorn	1	Rectangular Mil Spec Connectors 2 Row Thru Hole Receptacle	Other	RM222-010-221-2900	3D model available Symbol and footprint available 3	1 Download Model
	PCF2129AT/2,518 NXP	1	Real Time Clock RTC IC	Small Outline Packages	PCF2129AT/2,518	3D model available Symbol and footprint available 3	1 Download Model
	2129260-1 TE Connectivity	1	Body Features: Shell Base Material Stainless Steel \| Configuration Features: PCB Mount Orientation Right Angle \| Number of Rows 3 \| Number of Signal Positions 40 \| Number of Power Positions 0 \| Number of Positions 40 \| Contact Features: Contact Current Rating (Max) 1 AMP \| Number of Utility Contacts 0 \| Contact Base Material Copper Alloy \| Contact Mating Area Plating Material Thickness .38 MICM \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Housing Features: Housing Colo	Other	2129260-1	3D model available Symbol and footprint available 3	1 Download Model
	TSW-121-29-T-S SAMTEC	1	21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-121-29-T-S	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-121-29-TM-S SAMTEC	1	21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-121-29-TM-S	3D model not available Symbol and footprint available 2	1 Download Model
	R5F21292SNSP#U0 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SNSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21292SDSP#U0 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SDSP#U0	3D model available Symbol and footprint available 3	1 Download Model
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