21324 Model Download Search Results
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1-2132403-8
TE Connectivity
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1 | SFP+, Cage Assembly with Integrated Connector, .8mm [.032in] Centerline, Signal, Operating Temperature Range -55 – 105 °C [-67 – 221 °F] | Other | 1-2132403-8 |
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1-292132-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 14 Position, 2 mm [.079 in] Centerline, Partially Shrouded, Tin (Sn), Through Hole - Solder, AMP CT | Other | 1-292132-4 |
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R5F21324CDSP#54
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CDSP#54 |
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R5F21324DDSP#30
Renesas Electronics
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1 | The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324DDSP#30 |
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2-292132-4
TE Connectivity
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1 | Headers & Wire Housings CT P/HDR BOX V 4P BLUE | Header, Shrouded - Straight PTH Box | 2-292132-4 |
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R5F21324CDSP#U0
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CDSP#U0 |
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R5F21324CNSP#U0
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CNSP#U0 |
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R5F21324DNSP#W4
Renesas Electronics
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1 | The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324DNSP#W4 |
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R5F21324CNSP#54
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CNSP#54 |
3
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1-2132403-5
TE Connectivity
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1 | 2X5 SFP+ EMI Sprg 4 LP Sn Enhanced | Other | 1-2132403-5 |
3
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R5F21324MDSP#30
Renesas Electronics
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1 | The R8C/32M Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324MDSP#30 |
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R5F21324MDSP#54
Renesas Electronics
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1 | The R8C/32M Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324MDSP#54 |
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21324-50
Molex
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1 | Barrier Strip Terminal Block, 30A, 2 Row(s), 1 Deck(s) | 21324-50 |
0
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2132427-5
TE Connectivity
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1 | Board Connector, 72 Contact(s), 9 Row(s), Female, Right Angle, 0.075 inch Pitch, Press Fit Terminal, Black Insulator, Receptacle | 2132427-5 |
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21324-C
Molex
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1 | Barrier Strip Terminal Block, 30A, 2 Row(s), 1 Deck(s) | 21324-C |
0
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2132463-1
TE Connectivity
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1 | Board Connector, 12 Row(s), Female, Right Angle, Press Fit Terminal, Black Insulator | 2132463-1 |
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21324-58
Molex
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1 | Barrier Strip Terminal Block, 30A, 5.26mm2, 2 Row(s), 1 Deck(s) | 21324-58 |
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2132464-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 32 | Stackable No | Number of Rows 12 | Number of Signal Positions 64 | Number of Ground Positions 32 | Number of Positions 96 | PCB Mount Orientation Right Angle | Guide Location Left | Backplane Architecture Orthogonal | Number of Columns 8 | Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Finish Matte | Contact | 2132464-1 |
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2132442-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Columns 6 | Number of Rows 9 | Stackable No | Backplane Architecture Orthogonal | PCB Mount Orientation Right Angle | Number of Pairs 18 | Number of Positions 54 | Number of Signal Positions 36 | Number of Ground Positions 18 | Guide Location Unguided | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Underplating Material Thickness 50 MICIN | PCB Contac | 2132442-1 |
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2132424-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | Number of Signal Positions 36 | Number of Pairs 18 | Number of Rows 9 | Number of Columns 6 | Stackable No | Guide Location Unguided | Number of Positions 54 | Backplane Architecture Orthogonal | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thic | 2132424-1 |
1
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2132481-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Ground Positions 24 | Number of Columns 6 | Backplane Architecture Orthogonal | Guide Location Unguided | Number of Rows 12 | Number of Signal Positions 48 | Number of Positions 72 | Contact Features: PCB Contact Termination Area Plating Material Thickness 50 MICIN | Contact Current Rating (Max) .75 AMP | PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating M | 2132481-1 |
1
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2132479-1
TE Connectivity
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1 | IMP100O,R,RA4P6C,LG,46 | 2132479-1 |
1
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2132415-4
TE Connectivity
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1 | Board Connector, 4 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Natural Insulator | 2132415-4 |
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21324-61
Molex
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1 | Barrier Strip Terminal Block, 30A, 2 Row(s), 1 Deck(s) | 21324-61 |
0
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2132415-6
TE Connectivity
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1 | Board Connector, 6 Contact(s), 1 Row(s), Male, Straight, 0.098 inch Pitch, Solder Terminal, Locking, Natural Insulator | 2132415-6 |
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