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2170286-1
TE Connectivity
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1 | Configuration Features: Number of Positions 160 | Number of Ports 8 | Port Matrix Configuration 2 x 4 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 4 GBS | Housing Features: Centerline (Pitch) .8 MM | Cage Material Nickel Silver | Centerline | Other | 2170286-1 |
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B72500E2170K060
TDK
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1 | Chip Varistors / Ceramic Transient Voltage Suppressors, Maximum continuous voltage=22V, Maximum Clamping Voltage (8/20μs)=50V | Varistors Chip | B72500E2170K060 |
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DA7217-00U32
Renesas Electronics
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1 | The DA7217 is a high-performance, low power audio codec optimized for use in headsets or wearable devices. It has differential headphone outputs for use inside headset devices, offering excellent left to right channel separation and common mode noise rejection. DA7217 also has a stereo DAC to headphone output path and ultra-low power operating modes to support always-on audio detect applications.DA7217 contains two analog microphone input paths, or up to four digital microphone input paths, or a combination | Other | DA7217-00U32 |
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LTC2170CUKG-14#TRPBF
Analog Devices
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1 | 14-Bit, 25Msps Low Power Quad ADCs 0°C to 70°C | Quad Flat No-Lead | LTC2170CUKG-14#TRPBF |
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LTC2170CUKG-12#TRPBF
Analog Devices
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1 | 12-Bit, 25Msps Low Power Quad ADCs | Quad Flat No-Lead | LTC2170CUKG-12#TRPBF |
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2170409-5
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 40 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent | Other | 2170409-5 |
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32.21.7.012.2300
FINDER
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1 | SPST-NO min PCB relay,6A 12Vdc 1500W SPST-NO PCB Mount Non-Latching Relay Through Hole, 6 A, 12V dc | Other | 32.21.7.012.2300 |
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217082-2121
Molex
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1 | Mini Cool Edge (MCIO) Connector, Vertical, 8x PCIe Gen5, 74 Circuits, 0.75µm Gold (Au) Plated Contact, 1.50mm Solder Peg Length, Anti-Reverse Tabs, 1.27µm Nickel Plated Shell, with Pick and Place Cap | Other | 217082-2121 |
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0217005.
LITTELFUSE
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1 | Fuses with Leads (Through Hole) 250 V 5A 5x20mm Fast Acting | Resistors, Axial Diameter Horizontal Mounting | 0217005. |
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217063-0045
Molex
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1 | Headers & Wire Housings M-One 2mm VRT HDR SR 4CKT GW W/POTNG CAP-1 | Other | 217063-0045 |
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SSSU121700
ALPS Electric
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1 | Switch Slide DP Side Slide 0.1A 30VDC 10000Cycle PC Pins Bracket Mount/Through Hole Bulk - Bulk | Other | SSSU121700 |
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32.21.7.024.4000
FINDER
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1 | General Purpose Relay SPDT (1 Form C) 24VDC Coil Through Hole -40°C ~ 85°C,8.3 mA | Other | 32.21.7.024.4000 |
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IC51-0442-1709
Yamaichi
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1 | IC Socket, TSOP44, 44 Contact(s), 1.5748mm Term Pitch, 0.2/0.646inch Row Spacing, Solder | Other | IC51-0442-1709 |
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1-2321709-1
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 12 Position, 5 mm / 2.5 mm [.197 in / .098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder | Other | 1-2321709-1 |
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32.21.7.012.2000
FINDER
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1 | Finder SPDT Non-Latching Relay PCB Mount, 12V dc Coil, 6 A | Other | 32.21.7.012.2000 |
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217063-0055
Molex
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1 | Headers & Wire Housings M-One 2mm VRT HDR SR 5CKT GW W/POTNG CAP | Other | 217063-0055 |
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C0603C472K5RAC31217042
Yageo Group
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1 | Cap Ceramic 0.0047uF 50V X7R 10% Pad SMD 0603 125°C | Other | C0603C472K5RAC31217042 |
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C0603C391J5GAC31217042
Yageo Group
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1 | Cap Ceramic 390pF 50V C0G 5% Pad SMD 0603 125°C Extreme Low ESR | Capacitor Chip Non-polarised | C0603C391J5GAC31217042 |
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GWPLLRA1.CM-M7N2-XX52-1-700-R1
ams OSRAM
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1 | High-power LED with Chip-Scale-Package (CSP) Color temperature: 2700K - 6500K CRI: 90 (min.), 93 (typ.), R9: 50 (min.) | Other | GWPLLRA1.CM-M7N2-XX52-1-700-R1 |
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217063-0067
Molex
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1 | Headers & Wire Housings M-One 2mm VRT HDR SR 6CKT GW W/CVR Tape | Other | 217063-0067 |
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GW CSSRM3.CM-M9N4-A232-1-700-R33
ams OSRAM
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1 | AMS OSRAM GROUP - GW CSSRM3.CM-M9N4-A232-1-700-R33 - High Brightness LED, OSLON Square Series, Cool White, 120 °, 320 lm, 5700 K, 1.8 A | Other | GW CSSRM3.CM-M9N4-A232-1-700-R33 |
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C0603C334K4RAC31217042
Yageo Group
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1 | .330UF 16.0V | Capacitor Chip Non-polarised | C0603C334K4RAC31217042 |
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0217015.MXEP
LITTELFUSE
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1 | Fuses with Leads - Through Hole 250 V 15A 5x20mm Fast Acting | Other | 0217015.MXEP |
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LMZ21701SILT
Texas Instruments
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1 | 3V to 17V, 1A Step-Down DC/DC Power Module in 3.5mm × 3.5mm Package | Other | LMZ21701SILT |
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2170806-5
TE Connectivity
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1 | Body Features: Heat Sink Style Pin | Heat Sink Height Class SAN | Heat Sink Height .256 INCH | Heat Sink Finish Anodized Black | Configuration Features: Number of Rear EONs per Port Column 0 | Number of Ports 2 | Port Matrix Configuration 1 x 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver | Indu | Other | 2170806-5 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/021/702/861/2170286-1-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/021/702/861/2170286-1-t1.jpg/jcr:content/renditions/product-details.png",null])
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