2170- Model Download Search Results
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SSSU121700
ALPS Electric
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1 | Switch Slide DP Side Slide 0.1A 30VDC 10000Cycle PC Pins Bracket Mount/Through Hole Bulk - Bulk | Other | SSSU121700 |
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14131217001000
HARTING
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1 | Connectors, Header, Vertical, Rated current: ?15 A, Contacts: 12, Copper alloy, Tin plated, Coding: Please order coding pins separately. | Other | 14131217001000 |
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LTC2170CUKG-14#TRPBF
Analog Devices
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1 | 14-Bit, 25Msps Low Power Quad ADCs 0°C to 70°C | Quad Flat No-Lead | LTC2170CUKG-14#TRPBF |
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B72500E2170K060
TDK
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1 | Chip Varistors / Ceramic Transient Voltage Suppressors, Maximum continuous voltage=22V, Maximum Clamping Voltage (8/20μs)=50V | Varistors Chip | B72500E2170K060 |
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LTC2170CUKG-12#TRPBF
Analog Devices
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1 | 12-Bit, 25Msps Low Power Quad ADCs | Quad Flat No-Lead | LTC2170CUKG-12#TRPBF |
3
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2170630087
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 8 Circuits, Tin-Bismuth Plating, Black, with Potting Capability, with Cover Tape | Other | 2170630087 |
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STPS2170AFN
STMicroelectronics
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1 | 170 V, 2 A Power Schottky rectifier | Small Outline Diode Flat Lead | STPS2170AFN |
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2170409-5
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 40 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent | Other | 2170409-5 |
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2170286-1
TE Connectivity
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1 | Configuration Features: Number of Positions 160 | Number of Ports 8 | Port Matrix Configuration 2 x 4 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 4 GBS | Housing Features: Centerline (Pitch) .8 MM | Cage Material Nickel Silver | Centerline | Other | 2170286-1 |
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DA7217-00U32
Renesas Electronics
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1 | The DA7217 is a high-performance, low power audio codec optimized for use in headsets or wearable devices. It has differential headphone outputs for use inside headset devices, offering excellent left to right channel separation and common mode noise rejection. DA7217 also has a stereo DAC to headphone output path and ultra-low power operating modes to support always-on audio detect applications.DA7217 contains two analog microphone input paths, or up to four digital microphone input paths, or a combination | Other | DA7217-00U32 |
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14121217002000
HARTING
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1 | har-flexicon, 12pin male, horizontal pcb mount (THR/SMC), 15Amps, pitch 5.08mm | Other | 14121217002000 |
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ST02-170F1-5103
Shindengen Electric Manufacturing Co., Ltd.
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1 | ・TVS・Peak pulse power:200W・Small SMD・Available for automotive use・Pb free terminal・RoHS:Yes | Other | ST02-170F1-5103 |
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SL612170Z
Fischer Elektronik GmbH & Co. KG
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1 | Male PCB Connector, THT, 70 Position, Sanwich type for interconnections of stacked PCB's, 250 V AC, 2000V | Other | SL612170Z |
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217063-0067
Molex
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1 | Headers & Wire Housings M-One 2mm VRT HDR SR 6CKT GW W/CVR Tape | Other | 217063-0067 |
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LMZ21701SILT
Texas Instruments
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1 | 3V to 17V, 1A Step-Down DC/DC Power Module in 3.5mm × 3.5mm Package | Other | LMZ21701SILT |
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32.21.7.012.2000
FINDER
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1 | Finder SPDT Non-Latching Relay PCB Mount, 12V dc Coil, 6 A | Other | 32.21.7.012.2000 |
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C0603C472K5RAC31217042
Yageo Group
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1 | Cap Ceramic 0.0047uF 50V X7R 10% Pad SMD 0603 125°C | Other | C0603C472K5RAC31217042 |
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C0603C334K4RAC31217042
Yageo Group
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1 | .330UF 16.0V | Capacitor Chip Non-polarised | C0603C334K4RAC31217042 |
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GWPLLRA1.CM-M7N2-XX52-1-700-R1
ams OSRAM
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1 | High-power LED with Chip-Scale-Package (CSP) Color temperature: 2700K - 6500K CRI: 90 (min.), 93 (typ.), R9: 50 (min.) | Other | GWPLLRA1.CM-M7N2-XX52-1-700-R1 |
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1-2321709-1
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 12 Position, 5 mm / 2.5 mm [.197 in / .098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder | Other | 1-2321709-1 |
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0217015.MXEP
LITTELFUSE
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1 | Fuses with Leads - Through Hole 250 V 15A 5x20mm Fast Acting | Other | 0217015.MXEP |
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C0603C391J5GAC31217042
Yageo Group
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1 | Cap Ceramic 390pF 50V C0G 5% Pad SMD 0603 125°C Extreme Low ESR | Capacitor Chip Non-polarised | C0603C391J5GAC31217042 |
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GW CSSRM3.CM-M9N4-A232-1-700-R33
ams OSRAM
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1 | AMS OSRAM GROUP - GW CSSRM3.CM-M9N4-A232-1-700-R33 - High Brightness LED, OSLON Square Series, Cool White, 120 °, 320 lm, 5700 K, 1.8 A | Other | GW CSSRM3.CM-M9N4-A232-1-700-R33 |
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217063-0055
Molex
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1 | Headers & Wire Housings M-One 2mm VRT HDR SR 5CKT GW W/POTNG CAP | Other | 217063-0055 |
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2170630045
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 4 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | Other | 2170630045 |
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