3539- Model Download Search Results
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ESQ-135-39-L-S
SAMTEC
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1 | 35 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-L-S |
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LTC3539EDCB#TRPBF
Analog Devices
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1 | Switching Voltage Regulators 2A, 1MHz Synchronous Step-Up DC/DC Converter in 2mm x 3mm DFN Package | Small Outline No-lead | LTC3539EDCB#TRPBF |
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LTC3539EDCB-2TRMPBF
Analog Devices
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1 | 2A, 1MHz/2MHz 2A, Synchronous Step-Up DC/DC Converters | Small Outline No-lead | LTC3539EDCB-2TRMPBF |
3
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5353999-3
TE Connectivity
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1 | PCB Mount Receptacle, Vertical, Board-to-Board, 80 Position, .8 mm [.031 in] Centerline, Gold (Au), Surface Mount, Signal, Natural, Free Height | Other | 5353999-3 |
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MC0063W0603539K
Multicomp Pro
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1 | MULTICOMP - MC0063W0603539K - RES, THICK FILM, 39K, 5%, 0.063W, 0603 | Resistor Chip | MC0063W0603539K |
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ESW-135-39-H-D
SAMTEC
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1 | 70 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-135-39-H-D |
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ESQ-135-39-S-S
SAMTEC
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1 | 35 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-S-S |
2
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1-963539-2
TE Connectivity
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1 | Body Features: Connector & Keying Code C-F | Primary Product Color Black | Configuration Features: Number of Positions 18 | Number of Sections 1 | Number of Rows 2 | PCB Mount Orientation Horizontal | Number of Signal Positions 18 | Contact Features: Mating Tab Width .025 INCH | Contact Type Tab | Mating Tab Thickness .025 INCH | Mating Tab Width .63 MM | Mating Tab Thickness .63 MM | Contact Mating Area Plating Material Tin | Contact Size .63mm | Dimensions: Connector Length 38.08 MM | Profile Height from | Other | 1-963539-2 |
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70T3539MS166BC8
Renesas Electronics
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1 | The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V. | BGA | 70T3539MS166BC8 |
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70T3539MS166BCG
Renesas Electronics
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1 | The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V. | BGA | 70T3539MS166BCG |
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S-35390A-T8T1G
SII Semiconductor
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1 | Real Time Clock 2-Wire 1.3-5.5V | Small Outline Packages | S-35390A-T8T1G |
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3539
Keystone Electronics
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1 | Fuse Holder 4X3AG FUSE 4 FUSES HOLDER | Other | 3539 |
3
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MC0063W0603539R
Multicomp Pro
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1 | MULTICOMP - MC0063W0603539R - RES, THICK FILM, 39R, 5%, 0.063W, 0603 | Resistor Chip | MC0063W0603539R |
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1735397-1
TE Connectivity
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1 | 22 Position SATA Receptacle Connector Solder Through Hole , Contact Finish Gold, Contact Finish Thickness 15.0µin (0.38µm) | Other | 1735397-1 |
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S-35390A-I8T1U
SII Semiconductor
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1 | Real Time Clock 2-wire Real Time Clock | Other | S-35390A-I8T1U |
3
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BD3539FVM
ROHM Semiconductor
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1 | Power Management Specialised - PMIC MEMORY IC REG | Small Outline Packages | BD3539FVM |
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ESQ-135-39-G-S
SAMTEC
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1 | 35 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-G-S |
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ESQ-135-39-T-D
SAMTEC
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1 | 70 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-T-D |
2
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5353928-2
TE Connectivity
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1 | Body Features: Shell Plating Finish Bright | Shell Plating Material Tin | Connector Profile Standard | Offset 4 MM | Configuration Features: Number of Positions 4 | Panel Ground Location Right/Left | Number of Mounting Legs 2 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Dimensions | Other | 5353928-2 |
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ESW-135-39-G-D
SAMTEC
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1 | 70 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-135-39-G-D |
2
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ESQ-135-39-L-D
SAMTEC
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1 | 70 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-L-D |
2
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1-963539-1
TE Connectivity
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1 | PCB Mount Header, Horizontal, Wire-to-Board, 18 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Signal, Black | Other | 1-963539-1 |
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SLY303539GECO
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SLY303539GECO |
3
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5353999-1
TE Connectivity
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1 | 40 Position Connector Receptacle, Outer Shroud Contacts Surface Mount Gold | Other | 5353999-1 |
3
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5353999-5
TE Connectivity
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1 | 0.8FH,R05H.5,120,30/Sn,TR,SC | Other | 5353999-5 |
3
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![Part Image](["https://samtec-cdn.azureedge.net/kineticimages/images/product/series/esq_thumb.png","https://samtec-cdn.azureedge.net/kineticimages/images/product/series/esq_thumb.png",null])
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