403-5 Model Download Search Results
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403-54040-51
ept
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1 | 40 pins, unmated stacking height: 4.85 mm, for board-to-board distances from 11.1 to 20.0 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 403-54040-51 |
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403-54020-51
ept
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1 | 20 pins, unmated stacking height: 4.85 mm, for board-to-board distances from 11.1 to 20.0 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 403-54020-51 |
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403-54050-51
ept
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1 | 50 pins, unmated stacking height: 4.85 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 403-54050-51 |
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403-54080-51
ept
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1 | 80 pins, unmated stacking height: 4.85 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 403-54080-51 |
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403-54026-51
ept
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1 | 26 pins, unmated stacking height: 4.85 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 403-54026-51 |
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403-54016-51
ept
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1 | 16 pins, unmated stacking height: 4.85 mm, for board-to-board distances from 11.1 to 20.0 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 403-54016-51 |
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403-54012-51
ept
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1 | 12 pins, unmated stacking height: 4.85 mm, for board-to-board distances from 11.1 to 20.0 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 403-54012-51 |
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403-54068-51
ept
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1 | 68 pins, unmated stacking height: 4.85 mm, for board-to-board distances from 11.1 to 20.0 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged | Other | 403-54068-51 |
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1-1734035-2
TE Connectivity
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1 | Conn Mini USB 2.0 Type B RCP 5 POS 0.8mm Solder RA SMD 5 Terminal 1 Port T/R | Other | 1-1734035-2 |
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401-51403-51
ept
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1 | data transfer rate 16+ Gbit/s, for PCIe Gen4, for 5 mm board-to-board distance, 120 contacts, termination technology SMT, pitch 0.5 mm, Parallel, SMT, High Density, High Speed | Other | 401-51403-51 |
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T4144035051-000
TE Connectivity
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1 | Body Features: Shell Base Material Brass | Circular Connector Insulation Material Type Polyamide GF | Shell Plating Material Nickel | Configuration Features: Number of Signal Positions 5 | Number of Positions 5 | Number of Power Positions 0 | Contact Features: Circular Connector Contact Type Pin | Reverse Gender Yes | Housing Features: Circular Connector Shell Size 12 | Industry Standards: UL Flammability Rating UL 94HB | Mechanical Attachment: Polarization Code A | Mating Alignment Type Keyed | Mating Rete | Other | T4144035051-000 |
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2132403-5
TE Connectivity
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1 | Configuration Features: Number of Positions 200 | Number of Ports 10 | Port Matrix Configuration 2 x 5 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Cage | Other | 2132403-5 |
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1734035-4
TE Connectivity
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1 | Body Features: Connector Profile Mini | Offset 0 MM | Shell Plating Material Nickel | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Housing Features: Hous | Other | 1734035-4 |
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1734035-1
TE Connectivity
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1 | Body Features: Shell Plating Material Nickel | Offset 0 MM | Connector Profile Mini | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Housing Features: Cent | Other | 1734035-1 |
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1734035-2
TE Connectivity
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1 | Body Features: Offset 0 MM | Connector Profile Mini | Shell Plating Material Nickel | Configuration Features: Number of Ports 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Housing Features: Cent | Other | 1734035-2 |
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1734035-3
TE Connectivity
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1 | Body Features: Offset 0 MM | Connector Profile Mini | Shell Plating Material Nickel | Configuration Features: Number of Positions 5 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Housing Features: Hous | Other | 1734035-3 |
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015403.5DR
LITTELFUSE
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1 | Littelfuse 3.5A F Non-Resettable Surface Mount Fuse, 125 V | Other | 015403.5DR |
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SM104035005FE
Ohmite
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1 | Ohmite Slim Mox Series Planar Radial Thick Film Resistor 50MΩ ±1% 1.5W ±25 ppm/°C, ±50 ppm/°C | Other | SM104035005FE |
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SM104035006FE
Ohmite
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1 | Arcol Ohmite Slim Mox Series Radial Bare Metal Resistor 500MΩ ±1% 1.5W 25ppm/°C | Other | SM104035006FE |
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2-640358-4
TE Connectivity
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1 | IC & Component Sockets 16 CLOSED FRAME GOLD | Other | 2-640358-4 |
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AYF564035A
Panasonic
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1 | CONN FFC FPC 40POS .5MM SMT | Other | AYF564035A |
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MX25V4035FM1I
Macronix
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1 | NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3.3V 4M-bit 4M/2M/1M x 1/2-bit/4-bit 8ns 8-Pin SOP | Small Outline Packages | MX25V4035FM1I |
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2374035-1
TE Connectivity
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1 | PCB Mount Header, Horizontal, Wire-to-Board, 121 Position, 5.8 mm / 2.54 mm [.1 in / .228 in] Centerline, Fully Shrouded, Tin (Sn) | Other | 2374035-1 |
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UMPS-04-03.5-G-VT-SM-WT-K
SAMTEC
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1 | Power to the Board 2.00MM MICRO POWER TERMINAL VERTICAL 4P | Other | UMPS-04-03.5-G-VT-SM-WT-K |
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AYF-564035
Panasonic
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1 | FFC & FPC Connectors Impedance Matching 40pin FPC CONN | Other | AYF-564035 |
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