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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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4-794620-6
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 16 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Micro MATE-N-LOK | Other | 4-794620-6 |
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4-794682-8
TE Connectivity
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1 | 18P MICRO MNL ASSY,VRT,THRU,L | Other | 4-794682-8 |
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4-794628-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Right Angle | Number of Positions 12 | Number of Rows 2 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact | Other | 4-794628-2 |
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4-794682-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 4.81 MICM | Contact Retention Within Housing Without | Contact | Other | 4-794682-0 |
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4-794618-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.8 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Ho | Other | 4-794618-6 |
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4-794630-0
TE Connectivity
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1 | Configuration Features: Number of Positions 10 | Number of Rows 2 | Number of Power Positions 10 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Curr | Other | 4-794630-0 |
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4-794677-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Right Angle | Number of Positions 12 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Other | 4-794677-2 |
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4-794680-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Ma | Other | 4-794680-0 |
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4-794680-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | | Other | 4-794680-2 |
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1724479414
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 14 Circuits, Nylon 6/6, UL 94V-0 Glow-Wire Capable, Red | Other | 1724479414 |
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4-794637-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 10 | Number of Rows 2 | Number of Power Positions 10 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type | Other | 4-794637-0 |
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4-794638-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 14 | PCB Mount Orientation Vertical | Number of Positions 14 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thicknes | Other | 4-794638-4 |
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4-794619-6
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 16 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Micro MATE-N-LOK | Other | 4-794619-6 |
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4-794638-0
TE Connectivity
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1 | Configuration Features: Number of Positions 10 | PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area P | Other | 4-794638-0 |
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4-794629-4
TE Connectivity
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1 | Configuration Features: Number of Positions 14 | Number of Power Positions 14 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Matin | Other | 4-794629-4 |
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4-794618-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 12 | Number of Rows 2 | Number of Positions 12 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Other | 4-794618-2 |
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4-794618-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 14 | Number of Positions 14 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multi | Other | 4-794618-4 |
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1724479424
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 24 Circuits, Nylon 6/6, UL 94V-0 Glow-Wire Capable, Red | Other | 1724479424 |
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CY8C24794-24LTXI
Infineon
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1 | M8C PSOC®1 CY8C24xxx Microcontroller IC 8-Bit 24MHz 16KB (16K x 8) FLASH 56-QFN (8x8) | Quad Flat No-Lead | CY8C24794-24LTXI |
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C0603C479_4GAC
Yageo Group
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | C0603C479_4GAC |
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MAX4794EUS+T
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - MAX4794EUS+T - POWER LOAD SWITCH, 5.5V, -40 TO 85DEG C | Other | MAX4794EUS+T |
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47948-0001
Molex
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1 | Molex SMT Antenna 47948-0001, 2400 → 2483.5 MHz | Other | 47948-0001 |
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1724479402
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, 2 Circuits, Nylon 6/6, UL 94V-0, Tin (Sn) Plating, Glow-Wire Capable, Red | Other | 1724479402 |
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4-794632-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Rows 2 | Number of Positions 10 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Ma | Header, Shrouded - Straight PTH Box | 4-794632-0 |
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4-794638-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 16 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Ratin | Other | 4-794638-6 |
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