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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5787082-5
TE Connectivity
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1 | Body Features: Assembly Process Feature Material Copper Alloy | Connector Profile Standard | Shell Plating Finish Bright | Shell Plating Material Nickel over Copper | Primary Product Color Black | Configuration Features: Number of Rows 4 | PCB Mount Orientation Right Angle | Number of Positions 50 | Contact Features: Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 1 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Terminat | Other | 5787082-5 |
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C0603C472K5RAC7082
KEMET
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1 | SMD Comm X7R, Ceramic, 4700 pF, 10%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 100 GOhms, 4.8 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C472K5RAC7082 |
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C0603C103M4RAC7082
KEMET
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1 | SMD Comm X7R, Ceramic, 0.01 uF, 20%, 16 VDC, 40 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 3.5 % , 10 GOhms, 4.8 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C103M4RAC7082 |
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74438357082
Würth Elektronik
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1 | WURTH ELEKTRONIK - 74438357082 - Power Inductor (SMD), 8.2 µH, 2.8 A, Shielded, 5.2 A, WE-MAPI Series, 4.1mm x 4.1mm x 3.1mm | Other | 74438357082 |
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MAAD-007082-000100
MACOM
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1 | Attenuators DC-2.4GHz LSB 1dB Attn. Range 50dB | Other | MAAD-007082-000100 |
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145047030970829+
Kyocera AVX
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1 | 0.5mm pitch board to board connector | Other | 145047030970829+ |
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78438357082
Würth Elektronik
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1 | Fixed Inductors WE-MAIA 4030 8.2uH 20% 2.8A 86mOhm | Other | 78438357082 |
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TPS27082LDDCR
Texas Instruments
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1 | PFET Load Switch with Adjustable Slew Rate, Fast Transient Isolation & Hysteretic Control | SOT23 (6-Pin) | TPS27082LDDCR |
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74438367082
Würth Elektronik
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1 | Fixed Inductors WE-MAPI 5030 8.2uH 4.4A 57.5mOhms 20% | Inductors Chip | 74438367082 |
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8970825
RS Pro
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1 | 5mm PCB terminal block, std profile, 8P | Other | 8970825 |
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5787082-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Connector Profile Standard | Shell Plating Material Nickel over Copper | Assembly Process Feature Material Copper Alloy | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 4 | Number of Positions 26 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Pl | Other | 5787082-2 |
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C0603C104K5RAC7082
KEMET
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1 | SMD Comm X7R, Ceramic, 0.1 uF, 10%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 5 GOhms, 7.3 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C104K5RAC7082 |
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10146997-08200LF
Amphenol Communications Solutions
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1 | Minitek®Pwr 5.7, Right Angle Through Hole Header, Dual Row, Black Color, 8 Positions, 100μin Tin overall plating, LCP, GW Compatible, Tray packing. | Other | 10146997-08200LF |
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1708291
Phoenix Contact
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1 | PCB header, nominal cross section: 6 mm?, color: black, nominal current: 41 A, rated voltage (III/2): 630 V, contact surface: Tin, type of contact: Male connector, Number of rows: 1, Number of positions per row: 8, product range: PC 5/..-G, pitch: 7.62 mm, mounting: Wave soldering, pin layout: Linear three-way pinning, solder pin [P]: 5 mm, Stecksystem: POWER COMBICON 5, Locking: without, type of packaging: packed in cardboard | Other | 1708291 |
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5787082-7
TE Connectivity
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1 | Body Features: Assembly Process Feature Material Copper Alloy | Shell Plating Finish Bright | Primary Product Color Black | Connector Profile Standard | Shell Plating Material Nickel over Copper | Configuration Features: Number of Positions 68 | Number of Rows 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) 1 AMP | Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contac | Other | 5787082-7 |
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C0603C103K5RAC7082
KEMET
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1 | SMD Comm X7R, Ceramic, 0.01 uF, 10%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 10 GOhms, 4.8 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C103K5RAC7082 |
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C0603C104K4RAC7082
KEMET
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1 | SMD Comm X7R, Ceramic, 0.1 uF, 10%, 16 VDC, 40 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 3.5 % , 5 GOhms, 7.3 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C104K4RAC7082 |
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770-823
Wago
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1 | Socket for PCBs; straight; 3-pole; Cod. A | Other | 770-823 |
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C0603C472J5REC7082
KEMET
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1 | ESD SMD Comm X7R, Ceramic, 4700 pF, 5%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Electro Static Discharge, Class II, 2.5 % , 100 GOhms, 4.8 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C472J5REC7082 |
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C0603C104K3RAC7082
KEMET
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1 | SMD Comm X7R, Ceramic, 0.1 uF, 10%, 25 VDC, 62.5 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 3.5 % , 5 GOhms, 7.3 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C104K3RAC7082 |
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5787082-9
TE Connectivity
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1 | Body Features: Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Shell Plating Finish Bright | Connector Profile Standard | Shell Plating Material Nickel over Copper | Configuration Features: Number of Positions 100 | Number of Rows 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickn | Other | 5787082-9 |
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C0603C472J1REC7082
KEMET
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1 | ESD SMD Comm X7R, Ceramic, 4700 pF, 5%, 100 VDC, 250 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Electro Static Discharge, Class II, 2.5 % , 100 GOhms, 4.8 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C472J1REC7082 |
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885012007082
Würth Elektronik
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1 | Multilayer Ceramic Chip Capacitor WCAP-CSGP Series 0805 100pF NP00805101J100DFCT10000 | Capacitor Chip Non-polarised | 885012007082 |
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C0603C472J2REC7082
KEMET
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1 | ESD SMD Comm X7R, Ceramic, 4700 pF, 5%, 200 VDC, 500 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Electro Static Discharge, Class II, 2.5 % , 100 GOhms, 4.8 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 30000, 78 Weeks, 80 | Other | C0603C472J2REC7082 |
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770-825/011-000
Wago
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1 | Socket for PCBs; angled; 5-pole; Cod. A | Other | 770-825/011-000 |
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